
Proceedings Paper
Integrated RGB laser light module for autostereoscopic outdoor displaysFormat | Member Price | Non-Member Price |
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Paper Abstract
We have developed highly compact RGB laser light modules to be used as light sources in multi-view autostereoscopic
outdoor displays and projection devices. Each light module consists of an AlGaInP red laser diode, a GaInN blue laser
diode, a GaInN green laser diode, as well as a common cylindrical microlens. The plano-convex microlens is a so-called
“fast axis collimator”, which is widely used for collimating light beams emitted from high-power laser diode bars, and
has been optimized for polychromatic RGB laser diodes. The three light beams emitted from the red, green, and blue
laser diodes are collimated in only one transverse direction, the so-called “fast axis”, and in the orthogonal direction, the
so-called “slow axis”, the beams pass the microlens uncollimated. In the far field of the integrated RGB light module this
produces Gaussian beams with a large ellipticity which are required, e.g., for the application in autostereoscopic outdoor
displays. For this application only very low optical output powers of a few milliwatts per laser diode are required and
therefore we have developed tailored low-power laser diode chips with short cavity lengths of 250 μm for red and
300 μm for blue. Our RGB laser light module including the three laser diode chips, associated monitor photodiodes, the
common microlens, as well as the hermetically sealed package has a total volume of only 0.45 cm³, which to our
knowledge is the smallest RGB laser light source to date.
Paper Details
Date Published: 20 February 2015
PDF: 8 pages
Proc. SPIE 9346, Components and Packaging for Laser Systems, 934619 (20 February 2015); doi: 10.1117/12.2077177
Published in SPIE Proceedings Vol. 9346:
Components and Packaging for Laser Systems
Alexei L. Glebov; Paul O. Leisher, Editor(s)
PDF: 8 pages
Proc. SPIE 9346, Components and Packaging for Laser Systems, 934619 (20 February 2015); doi: 10.1117/12.2077177
Show Author Affiliations
Jörg Reitterer, TriLite Technologies GmbH (Austria)
Technische Univ. Wien (Austria)
Franz Fidler, TriLite Technologies GmbH (Austria)
Christian Hambeck, TriLite Technologies GmbH (Austria)
Ferdinand Saint Julien-Wallsee, TriLite Technologies GmbH (Austria)
Stephen Najda, TopGaN Sp. z o.o (Poland)
Piotr Perlin, TopGaN Sp. z o.o. (Poland)
Szymon Stanczyk, TopGaN Sp. z o.o. (Poland)
Technische Univ. Wien (Austria)
Franz Fidler, TriLite Technologies GmbH (Austria)
Christian Hambeck, TriLite Technologies GmbH (Austria)
Ferdinand Saint Julien-Wallsee, TriLite Technologies GmbH (Austria)
Stephen Najda, TopGaN Sp. z o.o (Poland)
Piotr Perlin, TopGaN Sp. z o.o. (Poland)
Szymon Stanczyk, TopGaN Sp. z o.o. (Poland)
Robert Czernecki, TopGaN Sp. z o.o. (Poland)
Stewart D. McDougall, Compound Semiconductor Technologies Global Ltd. (United Kingdom)
Wyn Meredith, Compound Semiconductor Technologies Global Ltd. (United Kingdom)
Garrie Vickers, Optocap Ltd. (United Kingdom)
Kennedy Landles, Optocap Ltd. (United Kingdom)
Ulrich Schmid, Technische Univ. Wien (Austria)
Stewart D. McDougall, Compound Semiconductor Technologies Global Ltd. (United Kingdom)
Wyn Meredith, Compound Semiconductor Technologies Global Ltd. (United Kingdom)
Garrie Vickers, Optocap Ltd. (United Kingdom)
Kennedy Landles, Optocap Ltd. (United Kingdom)
Ulrich Schmid, Technische Univ. Wien (Austria)
Published in SPIE Proceedings Vol. 9346:
Components and Packaging for Laser Systems
Alexei L. Glebov; Paul O. Leisher, Editor(s)
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