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Proceedings Paper

J-integral evaluation for an interface crack under thermal load using digital image correlation
Author(s): Hiroto Yamane; Shuichi Arikawa; Satoru Yoneyama; Yasuaki Watanabe; Tatsuhiko Asai; Kunio Shiokawa
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Paper Abstract

In this study, a method for evaluating a fracture parameter, J-integral, for an interface crack from the displacement fields under thermal deformation is developed for studying the fracture behavior of an interface crack in an actual electronic component. First, the displacement fields around an interface crack tip are measured using digital image correlation (DIC). Second, the displacement gradient and strain are determined from the displacement fields using a finite element smoothing technique on the domain of integration. Then, the stress components are determined from the strains using the elastic-plastic relations with the incremental strain theory and the each material property. Finally, the J-integral value is determined by the numerical integration on the domain of integration. The effectiveness of this evaluation method is demonstrated by applying this method to the displacement fields obtained from the elastic-plastic finite element analysis.

Paper Details

Date Published: 4 March 2015
PDF: 9 pages
Proc. SPIE 9302, International Conference on Experimental Mechanics 2014, 93022G (4 March 2015); doi: 10.1117/12.2076716
Show Author Affiliations
Hiroto Yamane, Aoyama Gakuin Univ. (Japan)
Shuichi Arikawa, Aoyama Gakuin Univ. (Japan)
Satoru Yoneyama, Aoyama Gakuin Univ. (Japan)
Yasuaki Watanabe, Fuji Electric Co., Ltd. (Japan)
Tatsuhiko Asai, Fuji Electric Co., Ltd. (Japan)
Kunio Shiokawa, Fuji Electric Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 9302:
International Conference on Experimental Mechanics 2014
Chenggen Quan; Kemao Qian; Anand Asundi; Fook Siong Chau, Editor(s)

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