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Proceedings Paper

Hybrid assembled micro scanner array with large aperture and their system integration for a 3D ToF laser camera
Author(s): Thilo Sandner; Claudia Baulig; Thomas Grasshoff; Michael Wildenhain; Markus Schwarzenberg; Hans-Georg Dahlmann; Stefan Schwarzer
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Paper Abstract

This paper presents a large aperture micro scanning mirror (MSM) array especially developed for the novel 3D-laser camera Fovea3D. This 3D-camera uses a pulsed ToF technique with 1MVoxel distance measuring rate and targets for a large measurement range of 30…100m and FOV of 120°x60° at video like frame rates. To guarantee a large reception aperture of ≥ 20mm, large FOV and 3200 Hz bi-directional scanning frequency at the same time, a hybrid assembled MSM array was developed consisting of 22 reception mirrors and a separate sending mirror. A hybrid assembly of frequency selected scanner elements and a driving in parametric resonance were chosen to enable a fully synchronized operation of all scanner elements. For position feedback piezo-resistive position sensors are integrated on each MEMS chip. The paper discusses details of the MEMS system integration including the synchronized operation of multiple scanning elements.

Paper Details

Date Published: 25 March 2015
PDF: 8 pages
Proc. SPIE 9375, MOEMS and Miniaturized Systems XIV, 937505 (25 March 2015); doi: 10.1117/12.2076440
Show Author Affiliations
Thilo Sandner, Fraunhofer-Institut für Photonische Mikrosysteme (Germany)
Claudia Baulig, Fraunhofer Institut für Physikalische Messtechnik (Germany)
Thomas Grasshoff, Fraunhofer-Institut für Photonische Mikrosysteme (Germany)
Michael Wildenhain, Fraunhofer-Institut für Photonische Mikrosysteme (Germany)
Markus Schwarzenberg, Fraunhofer-Institut für Photonische Mikrosysteme (Germany)
Hans-Georg Dahlmann, Fraunhofer-Institut für Photonische Mikrosysteme (Germany)
Stefan Schwarzer, Fraunhofer Institut für Physikalische Messtechnik (Germany)

Published in SPIE Proceedings Vol. 9375:
MOEMS and Miniaturized Systems XIV
Wibool Piyawattanametha; Yong-Hwa Park, Editor(s)

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