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Proceedings Paper

Electro-optical backplane demonstrator with integrated multimode gradient-index thin glass waveguide panel
Author(s): Henning Schröder; Lars Brusberg; Richard Pitwon; Simon Whalley; Kai Wang; Allen Miller; Christian Herbst; Daniel Weber; Klaus-Dieter Lang
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Paper Abstract

Optical interconnects for data transmission at board level offer increased energy efficiency, system density, and bandwidth scalability compared to purely copper driven systems. We present recent results on manufacturing of electrooptical printed circuit board (PCB) with integrated planar glass waveguides. The graded index multi-mode waveguides are patterned inside commercially available thin-glass panels by performing a specific ion-exchange process. The glass waveguide panel is embedded within the layer stack-up of a PCB using proven industrial processes. This paper describes the design, manufacture, assembly and characterization of the first electro-optical backplane demonstrator based on integrated planar glass waveguides. The electro-optical backplane in question is created by laminating the glass waveguide panel into a conventional multi-layer electronic printed circuit board stack-up. High precision ferrule mounts are automatically assembled, which will enable MT compliant connectors to be plugged accurately to the embedded waveguide interfaces on the glass panel edges. The demonstration platform comprises a standardized sub-rack chassis and five pluggable test cards each housing optical engines and pluggable optical connectors. The test cards support a variety of different data interfaces and can support data rates of up to 32 Gb/s per channel.

Paper Details

Date Published: 3 April 2015
PDF: 13 pages
Proc. SPIE 9368, Optical Interconnects XV, 93680U (3 April 2015); doi: 10.1117/12.2076254
Show Author Affiliations
Henning Schröder, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Lars Brusberg, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Richard Pitwon, Seagate Technology LLC (United Kingdom)
Simon Whalley, ILFA Feinstleitertechnik GmbH (Germany)
Kai Wang, Seagate Technology LLC (United Kingdom)
Allen Miller, Seagate Technology LLC (United Kingdom)
Christian Herbst, Technische Univ. Berlin (Germany)
Daniel Weber, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Klaus-Dieter Lang, Technische Univ. Berlin (Germany)

Published in SPIE Proceedings Vol. 9368:
Optical Interconnects XV
Henning Schröder; Ray T. Chen, Editor(s)

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