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Paper Abstract

This study quantifies the impact of systematic mask errors on OPC model accuracy and proposes a methodology to reconcile the largest errors via calibration to the mask error signature in wafer data. First, we examine through simulation, the impact of uncertainties in the representation of photomask properties including CD bias, corner rounding, refractive index, thickness, and sidewall angle. The factors that are most critical to be accurately represented in the model are cataloged. CD bias values are based on state of the art mask manufacturing data while other variable values are speculated, highlighting the need for improved metrology and communication between mask and OPC model experts. It is shown that the wafer simulations are highly dependent upon the 1D/2D representation of the mask, in addition to the mask sidewall for 3D mask models. In addition, this paper demonstrates substantial accuracy improvements in the 3D mask model using physical perturbations of the input mask geometry when using Domain Decomposition Method (DDM) techniques. Results from four test cases demonstrate that small, direct modifications in the input mask stack slope and edge location can result in model calibration and verification accuracy benefit of up to 30%. We highlight the benefits of a more accurate description of the 3D EMF near field with crosstalk in model calibration and impact as a function of mask dimensions. The result is a useful technique to align DDM mask model accuracy with physical mask dimensions and scattering via model calibration.

Paper Details

Date Published: 17 October 2014
PDF: 16 pages
Proc. SPIE 9231, 30th European Mask and Lithography Conference, 92310I (17 October 2014); doi: 10.1117/12.2066483
Show Author Affiliations
John Sturtevant, Mentor Graphics Corp. (United States)
Peter Buck, Mentor Graphics Corp. (United States)
Steffen Schulze, Mentor Graphics Corp. (United States)
David Fryer, Mentor Graphics Corp. (United States)
Edita Tejnil, Mentor Graphics Corp. (United States)
Kostas Adam, Mentor Graphics Corp. (United States)
Michael Lam, Mentor Graphics Corp. (United States)
Chris Clifford, Mentor Graphics Corp. (United States)
Mike Oliver, Mentor Graphics Corp. (United States)
Ana Armeanu, Mentor Graphics Corp. (France)
Franklin Kalk, Toppan Photomasks, Inc. (United States)
Kent Nakagawa, Toppan Photomasks, Inc. (United States)
Guoxiang Ning, GLOBALFOUNDRIES (United States)
Paul Ackmann, GLOBALFOUNDRIES (United States)
Fritz Gans, Advanced Mask Technology Ctr. (Germany)
Christian Buergel, Advanced Mask Technology Ctr. (Germany)

Published in SPIE Proceedings Vol. 9231:
30th European Mask and Lithography Conference
Uwe F. W. Behringer, Editor(s)

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