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Proceedings Paper

Low temperature solder process to join a copper tube to a silicon wafer
Author(s): Christo Versteeg; Marcio Scarpim de Souza
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Paper Abstract

With the application for wafer level packages, which could be Complementary Metal–Oxide–Semiconductor (CMOS) based, and which requires a reduced atmosphere, a copper tube connection to a vacuum pump and the package is proposed. The method evaluated uses laser assisted brazing of a solder, to join the copper tube to a silicon wafer. The method was applied to a silicon wafer coated with a metallic interface to bond to the solder. The hermeticity of the joint was tested with a helium leak rate tester and the bonding energy thermal extent was verified with a thin layer of indium that melted wherever the substrate temperature rose above its melting temperature.

Paper Details

Date Published: 23 June 2014
PDF: 5 pages
Proc. SPIE 9257, Sensors, MEMS and Electro-Optical Systems, 92570A (23 June 2014); doi: 10.1117/12.2066381
Show Author Affiliations
Christo Versteeg, Denel Dynamics (South Africa)
Marcio Scarpim de Souza, Brazilian Army Technology Ctr. (Brazil)

Published in SPIE Proceedings Vol. 9257:
Sensors, MEMS and Electro-Optical Systems
Monuko du Plessis, Editor(s)

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