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Proceedings Paper

Design, technology, and application of integrated piezoresistive scanning thermal microscopy (SThM) microcantilever
Author(s): Paweł Janus; Piotr Grabiec; Andrzej Sierakowski; Teodor Gotszalk; Maciej Rudek; Daniel Kopiec; Wojciech Majstrzyk; Guillaume Boetsch; Bernd Koehler
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Paper Abstract

In this article we describe a novel piezoresistive cantilever technology The described cantilever can be also applied in the investigations of the thermal surface properties in all Scanning Thermal Microscopy (SThM) techniques. Batch lithography/etch patterning process combined with focused ion beam (FIB) modification allows to manufacture thermally active, resistive tips with a nanometer radius of curvature. This design makes the proposed nanoprobes especially attractive for their application in the measurement of the thermal behavior of micro- and nanoelectronic devices. Developed microcantilever is equipped with piezoresistive deflection sensor. The proposed architecture of the cantilever probe enables easy its easy integration with micro- and nanomanipulators and scanning electron microscopes.In order to approach very precisely the microcantilever near to the location to be characterized, it is mounted on a compact nanomanipulator based on a novel mobile technology. This technology allows very stable positioning, with a nanometric resolution over several centimeters which is for example useful for large samples investigations. Moreover, thanks to the vacuum-compatibility, the experiments can be carried out inside scanning electron microscopes.

Paper Details

Date Published: 16 September 2014
PDF: 11 pages
Proc. SPIE 9236, Scanning Microscopies 2014, 92360R (16 September 2014); doi: 10.1117/12.2066240
Show Author Affiliations
Paweł Janus, Institute of Electron Technology (Poland)
Piotr Grabiec, Institute of Electron Technology (Poland)
Andrzej Sierakowski, Institute of Electron Technology (Poland)
Teodor Gotszalk, Wroclaw Univ. of Technology (Poland)
Maciej Rudek, Wroclaw Univ. of Technology (Poland)
Daniel Kopiec, Wroclaw Univ. of Technology (Poland)
Wojciech Majstrzyk, Wroclaw Univ. of Technology (Poland)
Guillaume Boetsch, Imina Technologies S.A. (Switzerland)
Bernd Koehler, Fraunhofer IKTS-MD (Germany)

Published in SPIE Proceedings Vol. 9236:
Scanning Microscopies 2014
Michael T. Postek; Dale E. Newbury; S. Frank Platek; Tim K. Maugel, Editor(s)

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