
Proceedings Paper
Design, technology, and application of integrated piezoresistive scanning thermal microscopy (SThM) microcantileverFormat | Member Price | Non-Member Price |
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Paper Abstract
In this article we describe a novel piezoresistive cantilever technology The described cantilever can be also applied in the
investigations of the thermal surface properties in all Scanning Thermal Microscopy (SThM) techniques. Batch
lithography/etch patterning process combined with focused ion beam (FIB) modification allows to manufacture thermally
active, resistive tips with a nanometer radius of curvature. This design makes the proposed nanoprobes especially
attractive for their application in the measurement of the thermal behavior of micro- and nanoelectronic devices.
Developed microcantilever is equipped with piezoresistive deflection sensor. The proposed architecture of the cantilever
probe enables easy its easy integration with micro- and nanomanipulators and scanning electron microscopes.In order to
approach very precisely the microcantilever near to the location to be characterized, it is mounted on a compact
nanomanipulator based on a novel mobile technology. This technology allows very stable positioning, with a nanometric
resolution over several centimeters which is for example useful for large samples investigations. Moreover, thanks to the
vacuum-compatibility, the experiments can be carried out inside scanning electron microscopes.
Paper Details
Date Published: 16 September 2014
PDF: 11 pages
Proc. SPIE 9236, Scanning Microscopies 2014, 92360R (16 September 2014); doi: 10.1117/12.2066240
Published in SPIE Proceedings Vol. 9236:
Scanning Microscopies 2014
Michael T. Postek; Dale E. Newbury; S. Frank Platek; Tim K. Maugel, Editor(s)
PDF: 11 pages
Proc. SPIE 9236, Scanning Microscopies 2014, 92360R (16 September 2014); doi: 10.1117/12.2066240
Show Author Affiliations
Paweł Janus, Institute of Electron Technology (Poland)
Piotr Grabiec, Institute of Electron Technology (Poland)
Andrzej Sierakowski, Institute of Electron Technology (Poland)
Teodor Gotszalk, Wroclaw Univ. of Technology (Poland)
Maciej Rudek, Wroclaw Univ. of Technology (Poland)
Piotr Grabiec, Institute of Electron Technology (Poland)
Andrzej Sierakowski, Institute of Electron Technology (Poland)
Teodor Gotszalk, Wroclaw Univ. of Technology (Poland)
Maciej Rudek, Wroclaw Univ. of Technology (Poland)
Daniel Kopiec, Wroclaw Univ. of Technology (Poland)
Wojciech Majstrzyk, Wroclaw Univ. of Technology (Poland)
Guillaume Boetsch, Imina Technologies S.A. (Switzerland)
Bernd Koehler, Fraunhofer IKTS-MD (Germany)
Wojciech Majstrzyk, Wroclaw Univ. of Technology (Poland)
Guillaume Boetsch, Imina Technologies S.A. (Switzerland)
Bernd Koehler, Fraunhofer IKTS-MD (Germany)
Published in SPIE Proceedings Vol. 9236:
Scanning Microscopies 2014
Michael T. Postek; Dale E. Newbury; S. Frank Platek; Tim K. Maugel, Editor(s)
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