Share Email Print

Proceedings Paper

Microchannel-based optical backplane demonstrators using FET-SEED smart pixel arrays
Author(s): David V. Plant; B. R. Robertson; Harvard Scott Hinton; Guillaume C. Boisset; N. H. Kim; Yong Sheng Liu; M. R. Otazo; D. R. Rolston; Alain Z. Shang; William M. Robertson
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

We have demonstrated a representative portion of an optical backplane using FET-SEED smart pixels and free-space optics to interconnect printed circuit boards (PCBs) in a two board, unidirectional link configuration. Four X four arrays of FET-SEED transceivers were designed, fabricated, and packaged at the PCB level. The optical interconnection was constructed using diffractive micro-optics, and custom optomechanics. The system was operated in two modes, one showing high data throughput, 50 MBit/sec, and the other demonstrating large connection densities, 2222 channel/cm2.

Paper Details

Date Published: 5 April 1995
PDF: 5 pages
Proc. SPIE 2400, Optoelectronic Interconnects III, (5 April 1995); doi: 10.1117/12.206306
Show Author Affiliations
David V. Plant, McGill Univ. (Canada)
B. R. Robertson, McGill Univ. (Canada)
Harvard Scott Hinton, McGill Univ. (Canada)
Guillaume C. Boisset, McGill Univ. (Canada)
N. H. Kim, McGill Univ. (Canada)
Yong Sheng Liu, McGill Univ. (Canada)
M. R. Otazo, McGill Univ. (Canada)
D. R. Rolston, McGill Univ. (Canada)
Alain Z. Shang, McGill Univ. (Canada)
William M. Robertson, McGill Univ. (Canada)

Published in SPIE Proceedings Vol. 2400:
Optoelectronic Interconnects III
Ray T. Chen; Harvard Scott Hinton, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?