Thermal dissipation had an important influence in the quantum effect of light emitting diodes (LED) because it enables transfer the heat from electric device away from the heat to the aluminum plate that can be used for heat removal. In the industrial processing, the quality of the thermal dissipation decides by the gumming technique between the PCB and aluminum plate. In this study, we fabricated a ceramic thin film of diamond like carbon (DLC) by vacuum sputtering, soldered the substrate of LED light to enhance the heat transfer. The dielectric coatings were characterized by several subsequent analyses, especially the measurement of real temperature. The X-Ray diffraction (XRD) diagram analysis reveals those ceramic phases were successfully grown on the individual substrate. The results show DLC thin film coating fabricated by vacuum sputtering has lower sheet resistivity, higher hardness, critical load, and thermal conduction, 3.5 Wm^-1 K^-1 to the purpose. The real temperature showed DLC thin film couldn’t transfer heat enough and limited work temperature of LED successfully as compared to aluminum nitride.

Date Published: 5 September 2014
PDF: 6 pages
Proc. SPIE 9200, Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications VIII, 92001B (5 September 2014); doi: 10.1117/12.2061347

Published in SPIE Proceedings Vol. 9200:
Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications VIII
Shizhuo Yin; Ruyan Guo, Editor(s)