
Proceedings Paper
Interferometric measurement of dimensional and thermal stability of jointsFormat | Member Price | Non-Member Price |
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Paper Abstract
In this work we demonstrate how absolute length measurements by interferometry, as used for regular gauge block
calibration, can be applied to measure the dimensional drift behavior of connections joined by gluing or screwing and
how these joining techniques are influenced by thermal treatment. While it is common to investigate the intrinsic
stability of material samples by repeated length measurements, there exist growing demands in precision engineering to
characterize the stability of assemblies, i.e. of joined material pieces. In order to enable investigation of joining
techniques representative joints were fabricated by a number of methods as wringing, screwing and gluing. By using
gauge block shaped samples as joining parts parallelism and flatness could be achieved which is needed for
interferometric length measurements. The stability of the joints has been investigated longitudinally and laterally to the
connection interface, and also mutual tilting of the parts was detected by analysis of the phase topographies. With the use
of sample joints, the behavior of connection elements used in ultrahigh-precision instruments can now be examined on
an accuracy level of about one nanometer. Results of approximately one year of observation show that screwed joints do
not exhibit a significant change of length or orientation. They also did not show response to temperature variations of
±10°C, which is different for adhesive joints where dimensional changes of up to 100 nm were observed.
Paper Details
Date Published: 27 August 2014
PDF: 8 pages
Proc. SPIE 9173, Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VIII, 91730B (27 August 2014); doi: 10.1117/12.2060382
Published in SPIE Proceedings Vol. 9173:
Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VIII
Michael T. Postek, Editor(s)
PDF: 8 pages
Proc. SPIE 9173, Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VIII, 91730B (27 August 2014); doi: 10.1117/12.2060382
Show Author Affiliations
Hagen Lorenz, Physikalisch-Technische Bundesanstalt (Germany)
René Schödel, Physikalisch-Technische Bundesanstalt (Germany)
Published in SPIE Proceedings Vol. 9173:
Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VIII
Michael T. Postek, Editor(s)
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