Proceedings Paper
Improved quality control of silicon wafers using novel off-line air pocket image analysis| Format | Member Price | Non-Member Price |
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Paper Abstract
Air pockets (APK) occur randomly in Czochralski (Cz) grown silicon (Si) crystals and may become included in wafers after
slicing and polishing. Previously the only APK of interest were those that intersected the front surface of the wafer and
therefore directly impacted device yield. However mobile and other electronics have placed new demands on wafers to
be internally APK-free for reasons of thermal management and packaging yield. We present a novel, recently patented,
APK image processing technique and demonstrate the use of that technique, off-line, to improve quality control during
wafer manufacturing.
Paper Details
Date Published: 27 August 2014
PDF: 9 pages
Proc. SPIE 9173, Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VIII, 91730A (27 August 2014); doi: 10.1117/12.2060227
Published in SPIE Proceedings Vol. 9173:
Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VIII
Michael T. Postek, Editor(s)
PDF: 9 pages
Proc. SPIE 9173, Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VIII, 91730A (27 August 2014); doi: 10.1117/12.2060227
Show Author Affiliations
John F. Valley, SunEdison Semiconductor, Inc. (United States)
M. Cristina Sanna, MEMC Electronic Materials SpA (Italy)
Published in SPIE Proceedings Vol. 9173:
Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VIII
Michael T. Postek, Editor(s)
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