
Proceedings Paper
Effect of dense planer focal plane array on device performancesFormat | Member Price | Non-Member Price |
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Paper Abstract
As the technologies in focal plane array (FPA) progresses, the industry is pushing for smaller
pixel size and spacing between the pixels. The reduction in pixel size and spacing will
increase both the resolution and fill factor which reduces the cost and increases the
performance. However, as the density of the array elements increases, the crosstalk between
the nearest neighboring pixels become a significant issue. Here we examine the case for a
planer FPA with epitaxially grown NIN+ structure and the planer junctions are formed by
diffusing P-type dopant into the N doped layer. We first examine the possible spacing by
considering the lateral depletion region width to set the upper boundary for the spacing. The
depletion region width is calculated by solving Poisson’s equation for Gaussian doping
profile and the isolation of adjacent pixel is dependent on the formation of the back to back
diodes to block the current flowing towards the device. Therefore overlap of the depletion
regions indicates shorting and sets the minimum possible spacing for this structure. The
electrical and optical crosstalks are modeled by using a DC resistive model to gauge the
effect of current flow as the spacing reduces. Series of device arrays with various device
pitches and device sizes ranging from 5 μm to 10 μm with device pitch from 5.5 μm to 15 μm
are fabricated and tested under both dark and illumination conditions for their electrical
performances including the crosstalk. The simulated and measured results will be presented.
Paper Details
Date Published: 11 June 2014
PDF: 7 pages
Proc. SPIE 9100, Image Sensing Technologies: Materials, Devices, Systems, and Applications, 91000K (11 June 2014); doi: 10.1117/12.2058154
Published in SPIE Proceedings Vol. 9100:
Image Sensing Technologies: Materials, Devices, Systems, and Applications
Nibir K. Dhar; Achyut K. Dutta, Editor(s)
PDF: 7 pages
Proc. SPIE 9100, Image Sensing Technologies: Materials, Devices, Systems, and Applications, 91000K (11 June 2014); doi: 10.1117/12.2058154
Show Author Affiliations
Achyut K. Dutta, Banpil Photonics, Inc. (United States)
Published in SPIE Proceedings Vol. 9100:
Image Sensing Technologies: Materials, Devices, Systems, and Applications
Nibir K. Dhar; Achyut K. Dutta, Editor(s)
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