
Proceedings Paper
Development of low-cost high-performance multispectral camera system at BanpilFormat | Member Price | Non-Member Price |
---|---|---|
$17.00 | $21.00 |
Paper Abstract
Banpil Photonics (Banpil) has developed a low-cost high-performance multispectral camera system for Visible to Short-
Wave Infrared (VIS-SWIR) imaging for the most demanding high-sensitivity and high-speed military, commercial and
industrial applications. The 640x512 pixel InGaAs uncooled camera system is designed to provide a compact, smallform
factor to within a cubic inch, high sensitivity needing less than 100 electrons, high dynamic range exceeding 190
dB, high-frame rates greater than 1000 frames per second (FPS) at full resolution, and low power consumption below
1W. This is practically all the feature benefits highly desirable in military imaging applications to expand deployment to
every warfighter, while also maintaining a low-cost structure demanded for scaling into commercial markets. This paper
describes Banpil’s development of the camera system including the features of the image sensor with an innovation
integrating advanced digital electronics functionality, which has made the confluence of high-performance capabilities
on the same imaging platform practical at low cost. It discusses the strategies employed including innovations of the key
components (e.g. focal plane array (FPA) and Read-Out Integrated Circuitry (ROIC)) within our control while
maintaining a fabless model, and strategic collaboration with partners to attain additional cost reductions on optics,
electronics, and packaging. We highlight the challenges and potential opportunities for further cost reductions to achieve
a goal of a sub-$1000 uncooled high-performance camera system. Finally, a brief overview of emerging military,
commercial and industrial applications that will benefit from this high performance imaging system and their forecast
cost structure is presented.
Paper Details
Date Published: 11 June 2014
PDF: 9 pages
Proc. SPIE 9100, Image Sensing Technologies: Materials, Devices, Systems, and Applications, 910006 (11 June 2014); doi: 10.1117/12.2058153
Published in SPIE Proceedings Vol. 9100:
Image Sensing Technologies: Materials, Devices, Systems, and Applications
Nibir K. Dhar; Achyut K. Dutta, Editor(s)
PDF: 9 pages
Proc. SPIE 9100, Image Sensing Technologies: Materials, Devices, Systems, and Applications, 910006 (11 June 2014); doi: 10.1117/12.2058153
Show Author Affiliations
Patrick Oduor, Banpil Photonics, Inc. (United States)
Genki Mizuno, Banpil Photonics, Inc. (United States)
Genki Mizuno, Banpil Photonics, Inc. (United States)
Robert Olah, Banpil Photonics, Inc. (United States)
Achyut K. Dutta, Banpil Photonics, Inc. (United States)
Achyut K. Dutta, Banpil Photonics, Inc. (United States)
Published in SPIE Proceedings Vol. 9100:
Image Sensing Technologies: Materials, Devices, Systems, and Applications
Nibir K. Dhar; Achyut K. Dutta, Editor(s)
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