
Proceedings Paper
Smart pixel imaging with computational-imaging arraysFormat | Member Price | Non-Member Price |
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Paper Abstract
Smart pixel imaging with computational-imaging arrays (SPICA) transfers image plane coding typically realized in the optical architecture to the digital domain of the focal plane array, thereby minimizing signal-to-noise losses associated with static filters or apertures and inherent diffraction concerns. MIT Lincoln Laboratory has been developing digitalpixel focal plane array (DFPA) devices for many years. In this work, we leverage legacy designs modified with new features to realize a computational imaging array (CIA) with advanced pixel-processing capabilities. We briefly review the use of DFPAs for on-chip background removal and image plane filtering. We focus on two digital readout integrated circuits (DROICS) as CIAs for two-dimensional (2D) transient target tracking and three-dimensional (3D) transient target estimation using per-pixel coded-apertures or flutter shutters. This paper describes two DROICs – a SWIR pixelprocessing imager (SWIR-PPI) and a Visible CIA (VISCIA). SWIR-PPI is a DROIC with a 1 kHz global frame rate with a maximum per-pixel shuttering rate of 100 MHz, such that each pixel can be modulated by a time-varying, pseudorandom, and duo-binary signal (+1,-1,0). Combining per-pixel time-domain coding and processing enables 3D (x,y,t) target estimation with limited loss of spatial resolution. We evaluate structured and pseudo-random encoding strategies and employ linear inversion and non-linear inversion using total-variation minimization to estimate a 3D data cube from a single 2D temporally-encoded measurement. The VISCIA DROIC, while low-resolution, has a 6 kHz global frame rate and simultaneously encodes eight periodic or aperiodic transient target signatures at a maximum rate of 50 MHz using eight 8-bit counters. By transferring pixel-based image plane coding to the DROIC and utilizing sophisticated processing, our CIAs enable on-chip temporal super-resolution.
Paper Details
Date Published: 1 July 2014
PDF: 13 pages
Proc. SPIE 9070, Infrared Technology and Applications XL, 90703D (1 July 2014); doi: 10.1117/12.2057520
Published in SPIE Proceedings Vol. 9070:
Infrared Technology and Applications XL
Bjørn F. Andresen; Gabor F. Fulop; Charles M. Hanson; Paul R. Norton, Editor(s)
PDF: 13 pages
Proc. SPIE 9070, Infrared Technology and Applications XL, 90703D (1 July 2014); doi: 10.1117/12.2057520
Show Author Affiliations
Christy Fernandez-Cull, MIT Lincoln Lab. (United States)
Brian M. Tyrrell, MIT Lincoln Lab. (United States)
Richard D'Onofrio, MIT Lincoln Lab. (United States)
Andrew Bolstad, MIT Lincoln Lab. (United States)
Joseph Lin, MIT Lincoln Lab. (United States)
Brian M. Tyrrell, MIT Lincoln Lab. (United States)
Richard D'Onofrio, MIT Lincoln Lab. (United States)
Andrew Bolstad, MIT Lincoln Lab. (United States)
Joseph Lin, MIT Lincoln Lab. (United States)
Jeffrey W. Little, MIT Lincoln Lab. (United States)
Megan Blackwell, MIT Lincoln Lab. (United States)
Matthew Renzi, MIT Lincoln Lab. (United States)
RVS (United States)
Mike Kelly, MIT Lincoln Lab. (United States)
Megan Blackwell, MIT Lincoln Lab. (United States)
Matthew Renzi, MIT Lincoln Lab. (United States)
RVS (United States)
Mike Kelly, MIT Lincoln Lab. (United States)
Published in SPIE Proceedings Vol. 9070:
Infrared Technology and Applications XL
Bjørn F. Andresen; Gabor F. Fulop; Charles M. Hanson; Paul R. Norton, Editor(s)
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