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Proceedings Paper

Applications of infrared thermography for nondestructive testing of fatigue cracks in steel bridges
Author(s): Takahide Sakagami; Yui Izumi; Yoshihiro Kobayashi; Yoshiaki Mizokami; Sunao Kawabata
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Paper Abstract

In recent years, fatigue crack propagations in aged steel bridge which may lead to catastrophic structural failures have become a serious problem. For large-scale steel structures such as orthotropic steel decks in highway bridges, nondestructive inspection of deteriorations and fatigue damages are indispensable for securing their safety and for estimating their remaining strength. As conventional NDT techniques for steel bridges, visual testing, magnetic particle testing and ultrasonic testing have been commonly employed. However, these techniques are time- and labor- consuming techniques, because special equipment is required for inspection, such as scaffolding or a truck mount aerial work platform. In this paper, a new thermography NDT technique, which is based on temperature gap appeared on the surface of structural members due to thermal insulation effect of the crack, is developed for detection of fatigue cracks. The practicability of the developed technique is demonstrated by the field experiments for highway steel bridges in service. Detectable crack size and factors such as measurement time, season or spatial resolution which influence crack detectability are investigated.

Paper Details

Date Published: 21 May 2014
PDF: 8 pages
Proc. SPIE 9105, Thermosense: Thermal Infrared Applications XXXVI, 91050S (21 May 2014); doi: 10.1117/12.2057382
Show Author Affiliations
Takahide Sakagami, Kobe Univ. (Japan)
Yui Izumi, Univ. of Shiga Prefecture (Japan)
Yoshihiro Kobayashi, Honshu-Shikoku Bridge Expressway Co., Ltd. (Japan)
Yoshiaki Mizokami, Honshu-Shikoku Bridge Expressway Co., Ltd. (Japan)
Sunao Kawabata, Honshu-Shikoku Bridge Expressway Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 9105:
Thermosense: Thermal Infrared Applications XXXVI
Gregory R. Stockton; Fred P. Colbert; Sheng-Jen (Tony) Hsieh, Editor(s)

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