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Proceedings Paper

Algorithm design for use in cross-sectional x-ray image analysis of solder joints
Author(s): Paul A. Roder
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Paper Abstract

This paper introduces algorithm design concepts that have proven useful in real-time X-ray solder joint inspection systems. Real-time industrial inspection systems face tremendous challenges, which are not always obvious when first designing such systems. The goal of this paper is to introduce a few of these challenges, as well as software and algorithm methodologies that effectively deal with some of these challenges. Specific examples included involve the real-time inspection of circuit board solder joints using cross-sectional X-ray images. Methods for dealing with solder joint orientations, utilities preserving subpixel and subgray level accuracy, and designs enabling code sharing are presented.

Paper Details

Date Published: 27 March 1995
PDF: 12 pages
Proc. SPIE 2423, Machine Vision Applications in Industrial Inspection III, (27 March 1995); doi: 10.1117/12.205525
Show Author Affiliations
Paul A. Roder, Four Pi Systems (United States)


Published in SPIE Proceedings Vol. 2423:
Machine Vision Applications in Industrial Inspection III
Frederick Y. Wu; Stephen S. Wilson, Editor(s)

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