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Proceedings Paper

Miniaturization of sub-meter resolution hyperspectral imagers on unmanned aerial systems
Author(s): Samuel L. Hill; Peter Clemens
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Paper Abstract

Traditional airborne environmental monitoring has frequently deployed hyperspectral imaging as a leading tool for characterizing and analyzing a scene’s critical spectrum-based signatures for applications in agriculture genomics and crop health, vegetation and mineral monitoring, and hazardous material detection. As the acceptance of hyperspectral evaluation grows in the airborne community, there has been a dramatic trend in moving the technology from use on midsize aircraft to Unmanned Aerial Systems (UAS). The use of UAS accomplishes a number of goals including the reduction in cost to run multiple seasonal evaluations over smaller but highly valuable land-areas, the ability to use frequent data collections to make rapid decisions on land management, and the improvement of spatial resolution by flying at lower altitudes (< 150 m). Despite this trend, there are several key parameters affecting the use of traditional hyperspectral instruments in UAS with payloads less than 0.5 kg (~1lb) where size, weight and power (SWaP) are critical to how high and how far a given UAS can fly. Additionally, on many of the light-weight UAS, users are frequently trying to capture data from one or more instruments to augment the hyperspectral data collection, thus reducing the amount of SWaP available to the hyperspectral instrumentation. The following manuscript will provide an analysis on a newly-developed miniaturized hyperspectral imaging platform that provides full hyperspectral resolution and traditional hyperspectral capabilities without sacrificing performance to accommodate the decreasing SWaP of smaller and smaller UAS platforms.

Paper Details

Date Published: 28 May 2014
PDF: 11 pages
Proc. SPIE 9104, Spectral Imaging Sensor Technologies: Innovation Driving Advanced Application Capabilities, 91040A (28 May 2014); doi: 10.1117/12.2054822
Show Author Affiliations
Samuel L. Hill, Headwall Photonics, Inc. (United States)
Peter Clemens, Headwall Photonics, Inc. (United States)

Published in SPIE Proceedings Vol. 9104:
Spectral Imaging Sensor Technologies: Innovation Driving Advanced Application Capabilities
David P. Bannon, Editor(s)

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