Share Email Print

Proceedings Paper

Clear sub-resolution assist features for EUV
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

In EUV lithography, the short wavelength of the light makes the topography of the mask stand out as three dimensional objects rather than thin masks. This generally requires use of a rigorous scattering simulator to calculate the diffracted orders of a mask in order to explain experimental results. In contrast, for optical proximity correction we cannot afford such detailed calculations and we would like to replace such detailed simulations with faster methods that give similar results. In this paper, we discuss observations we made during our printing experiments on a 0.33 NA EUV projection system. In order to extend the process window for non-nested trenches we introduced clear assist features. We observed strong tilt of Bossung curves and best focus shifts for certain pitches. These shifts can be explained by a phase difference between main and assist feature. This effect is very similar for both horizontal and vertical trenches, and it depends strongly on the illumination of the mask. We find that the best focus shift can be minimized for certain assist pitches and illumination conditions, but a general solution for random pitches appears not obvious.

Paper Details

Date Published: 17 April 2014
PDF: 7 pages
Proc. SPIE 9048, Extreme Ultraviolet (EUV) Lithography V, 904838 (17 April 2014); doi: 10.1117/12.2048311
Show Author Affiliations
Martin Burkhardt, IBM Research (United States)
Greg McIntyre, IBM Corp. (United States)
Ralph Schlief, GLOBALFOUNDRIES Inc. (United States)
Lei Sun, GLOBALFOUNDRIES Inc. (United States)

Published in SPIE Proceedings Vol. 9048:
Extreme Ultraviolet (EUV) Lithography V
Obert R. Wood II; Eric M. Panning, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?