
Proceedings Paper
Particle control challenges in process chemicals and ultra-pure water for sub-10nm technology nodesFormat | Member Price | Non-Member Price |
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Paper Abstract
Particle contamination in ultra-pure water (UPW) and chemicals will eventually end up on the surface of a wafer and may result in killer defects. To improve the semiconductor processing yield in sub-10 nm half pitch nodes, it is necessary to control particle defectivity. In a systematic study of all major techniques for particle detection, counting, and sizing in solutions, we have shown that there is a gap in the required particle metrology which needs to be addressed by the industry. To reduce particles in solutions and improve filter retention for sub-10 nm particles with very low densities (<10 particles/mL), liquid particle counters that are able to detect small particles at low densities are required. Non-volatile residues in chemicals and UPW can result in nanoparticles. Measuring absolute non-volatile residues in UPW with concentrations in the ppb range is a challenge. However, by using energy-dispersive spectroscopy (EDS) analysis through transmission electron microscopy (TEM) of non-volatile residues we found silica both in dissolved and colloidal particle form which is present in one of the cleanest UPW that we tested. A particle capture/release technique was developed at SEMATECH which is able to collect particles from UPW and release them in a controlled manner.
Using this system we showed sub-10 nm particles are present in UPW. In addition to colloidal silica, agglomerated carbon containing particles were also found in UPW.
Paper Details
Date Published: 17 April 2014
PDF: 14 pages
Proc. SPIE 9048, Extreme Ultraviolet (EUV) Lithography V, 90480P (17 April 2014); doi: 10.1117/12.2048080
Published in SPIE Proceedings Vol. 9048:
Extreme Ultraviolet (EUV) Lithography V
Obert R. Wood II; Eric M. Panning, Editor(s)
PDF: 14 pages
Proc. SPIE 9048, Extreme Ultraviolet (EUV) Lithography V, 90480P (17 April 2014); doi: 10.1117/12.2048080
Show Author Affiliations
Abbas Rastegar, SEMATECH Inc. (United States)
Martin Samayoa, SEMATECH Inc. (United States)
Matthew House, SEMATECH Inc. (United States)
Hüseyin Kurtuldu, SEMATECH Inc. (United States)
Martin Samayoa, SEMATECH Inc. (United States)
Matthew House, SEMATECH Inc. (United States)
Hüseyin Kurtuldu, SEMATECH Inc. (United States)
Sang-Kee Eah, SEMATECH Inc. (United States)
Lauren Morse, SEMATECH Inc. (United States)
Jenah Harris-Jones, SEMATECH Inc. (United States)
Lauren Morse, SEMATECH Inc. (United States)
Jenah Harris-Jones, SEMATECH Inc. (United States)
Published in SPIE Proceedings Vol. 9048:
Extreme Ultraviolet (EUV) Lithography V
Obert R. Wood II; Eric M. Panning, Editor(s)
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