
Proceedings Paper
Study of acid diffusion behaves form PAG by using top coat methodFormat | Member Price | Non-Member Price |
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Paper Abstract
Our past research on measurements of simulation parameters for ArF resists focused on establishing
methods for measuring the following parameters:[1]-[4]
• Development parameters[1]
• PEB parameters[2]
• Dill’s ABC parameters[3]
• Quencher parameter[4]
We entered these parameters into a lithography simulator and performed ArF resist simulations.We
then explored ways to optimize the ArF resist material and process. This paper reports on our study
of methods for measuring the diffusion length of acid generated from PAG during exposures. In our
experiment, we applied a PAG-containing top coat (TC) material (second layer) to a PAG-free ArF
resist (first layer), then performed the exposure and PEB processes. The acid generated in the TC
during the exposure diffused into the ArF resist in the lower layer (first layer) when PEB was
performed. The process of developing this sample removed the TC in the second layer and the parts
of the first layer into which the acid had diffused.We obtained the acid diffusion length based on the
quantity of film removed by the development. We calculated the acid diffusion coefficient after
varying the exposure value and repeating the measurement. For this report, we also performed
measurements to determine how differences in PAG anion size, amount of quencher additive, and
PEB temperature affected the acid diffusion coefficient.We entered the measurements obtained into
the PROLITH simulator and explored the effects of acid diffusion on pattern profile.
Paper Details
Date Published: 27 March 2014
PDF: 13 pages
Proc. SPIE 9051, Advances in Patterning Materials and Processes XXXI, 90511S (27 March 2014); doi: 10.1117/12.2043205
Published in SPIE Proceedings Vol. 9051:
Advances in Patterning Materials and Processes XXXI
Thomas I. Wallow; Christoph K. Hohle, Editor(s)
PDF: 13 pages
Proc. SPIE 9051, Advances in Patterning Materials and Processes XXXI, 90511S (27 March 2014); doi: 10.1117/12.2043205
Show Author Affiliations
Atsushi Sekiguchi, Litho Tech Japan Corp. (Japan)
Yoko Matsumoto, Litho Tech Japan Corp. (Japan)
Published in SPIE Proceedings Vol. 9051:
Advances in Patterning Materials and Processes XXXI
Thomas I. Wallow; Christoph K. Hohle, Editor(s)
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