Proceedings Paper
Silicon on insulator optical modulators for integration in photonic optical circuits| Format | Member Price | Non-Member Price |
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Paper Abstract
This paper summarises our work on modulators for integration, either as a front end approach, or a co-location of custom electronic drivers, approaches that have yielded data rates up to 50Gb/s from a range of device variants. As well as more conventional depletion based devices, we also report photonic crystal cavity based modulators for very low power consumption, as well as other device variants aimed at improving device performance metrics.
Paper Details
Date Published: 8 March 2014
PDF: 8 pages
Proc. SPIE 8991, Optical Interconnects XIV, 89910K (8 March 2014); doi: 10.1117/12.2042911
Published in SPIE Proceedings Vol. 8991:
Optical Interconnects XIV
Henning Schröder; Ray T. Chen; Alexei L. Glebov, Editor(s)
PDF: 8 pages
Proc. SPIE 8991, Optical Interconnects XIV, 89910K (8 March 2014); doi: 10.1117/12.2042911
Show Author Affiliations
G. T. Reed, Univ. of Southampton (United Kingdom)
D. J. Thomson, Univ. of Southampton (United Kingdom)
F. Y. Gardes, Univ. of Southampton (United Kingdom)
G. Z. Mashanovich, Univ. of Southampton (United Kingdom)
Y. Hu, Univ. of Southampton (United Kingdom)
L. Ke, Univ. of Southampton (United Kingdom)
P. W. Wilson, Univ. of Southampton (United Kingdom)
L. Zimmermann, IHP GmbH (Germany)
D. Knoll, IHP GmbH (Germany)
S. Lischke, IHP GmbH (Germany)
H. Porte, Photline Technologies (France)
B. Goll, Technische Univ. Wien (Austria)
D. J. Thomson, Univ. of Southampton (United Kingdom)
F. Y. Gardes, Univ. of Southampton (United Kingdom)
G. Z. Mashanovich, Univ. of Southampton (United Kingdom)
Y. Hu, Univ. of Southampton (United Kingdom)
L. Ke, Univ. of Southampton (United Kingdom)
P. W. Wilson, Univ. of Southampton (United Kingdom)
L. Zimmermann, IHP GmbH (Germany)
D. Knoll, IHP GmbH (Germany)
S. Lischke, IHP GmbH (Germany)
H. Porte, Photline Technologies (France)
B. Goll, Technische Univ. Wien (Austria)
H. Zimmermann, Technische Univ. Wien (Austria)
S-W. Chen, National Tsing Hua Univ. (Taiwan)
S. H. Hsu, National Tsing Hua Univ. (Taiwan)
J-M. Fedeli, CEA-LETI-Minatec (France)
K. Debnath, Univ. of St. Andrews (United Kingdom)
L. O’Faolain, Univ. of St. Andrews (United Kingdom)
T. F. Krauss, The Univ. of York (United Kingdom)
M. Aamer, Univ. Politècnica de València (Spain)
A. Brimont, Univ. Politècnica de València (Spain)
P. Sanchis, Univ. Politècnica de València (Spain)
A. Hakansson, Univ. Politècnica de València (Spain)
S-W. Chen, National Tsing Hua Univ. (Taiwan)
S. H. Hsu, National Tsing Hua Univ. (Taiwan)
J-M. Fedeli, CEA-LETI-Minatec (France)
K. Debnath, Univ. of St. Andrews (United Kingdom)
L. O’Faolain, Univ. of St. Andrews (United Kingdom)
T. F. Krauss, The Univ. of York (United Kingdom)
M. Aamer, Univ. Politècnica de València (Spain)
A. Brimont, Univ. Politècnica de València (Spain)
P. Sanchis, Univ. Politècnica de València (Spain)
A. Hakansson, Univ. Politècnica de València (Spain)
Published in SPIE Proceedings Vol. 8991:
Optical Interconnects XIV
Henning Schröder; Ray T. Chen; Alexei L. Glebov, Editor(s)
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