
Proceedings Paper
Characterisation of CFRP adhesive bonds by electromechanical impedanceFormat | Member Price | Non-Member Price |
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Paper Abstract
In aircraft industry the Carbon Fiber Reinforced Polymer (CFRP) elements are joint using rivets and adhesive bonding.
The reliability of the bonding limits the use of adhesive bonding for primary aircraft structures, therefore it is important
to assess the bond quality. The performance of adhesive bonds depends on the physico-chemical properties of the
adhered surfaces. The contamination leading to weak bonds may have various origin and be caused by moisture, release
agent, hydraulic fluid, fuel, poor curing of adhesive and so on. In this research three different causes of possible weak
bonds were selected for the investigation: 1. Weak bond due to release agent contamination, 2. Weak bond due to
moisture contamination, 3. Weak bond due to poor curing of the adhesive. In order to assess the bond quality
electromechanical impedance (EMI) technique was selected and investigation was focused on the influence of bond
quality on electrical impedance of piezoelectric transducer. The piezoelectric transducer was mounted at the middle of
each sample surface. Measurements were conducted using HIOKI Impedance Analyzer IM3570. Using the impedance
analyzer the electrical parameters were measured for wide frequency band. Due to piezoelectric effect the electrical
response of a piezoelectric transducer is related to mechanical response of the sample to which the transducers is
attached. The impedance spectra were investigated in order to find indication of the weak bonds. These spectra were
compared with measurements for reference sample using indexes proposed in order to assess the bond quality.
Paper Details
Date Published: 9 March 2014
PDF: 7 pages
Proc. SPIE 9064, Health Monitoring of Structural and Biological Systems 2014, 906415 (9 March 2014); doi: 10.1117/12.2042868
Published in SPIE Proceedings Vol. 9064:
Health Monitoring of Structural and Biological Systems 2014
Tribikram Kundu, Editor(s)
PDF: 7 pages
Proc. SPIE 9064, Health Monitoring of Structural and Biological Systems 2014, 906415 (9 March 2014); doi: 10.1117/12.2042868
Show Author Affiliations
Pawel H. Malinowski, The Szewalski Institute of Fluid-Flow Machinery (Poland)
Tomasz Wandowski, The Szewalski Institute of Fluid-Flow Machinery (Poland)
Tomasz Wandowski, The Szewalski Institute of Fluid-Flow Machinery (Poland)
Wieslaw M. Ostachowicz, The Szewalski Institute of Fluid-Flow Machinery (Poland)
Warsaw Univ. of Technology (Poland)
Warsaw Univ. of Technology (Poland)
Published in SPIE Proceedings Vol. 9064:
Health Monitoring of Structural and Biological Systems 2014
Tribikram Kundu, Editor(s)
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