Proceedings Paper
Plasmonic modulator for three-dimensional chip-to-chip optical interconnects| Format | Member Price | Non-Member Price |
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Paper Abstract
We present a surface-normal plasmonic modulator structure for three-dimensional (3-D) optical interconnects using subwavelength metallic photonic crystals. Optical transmission of the metallic slab was controlled by modulating the plasmonic bandgap of the metallic photonic crystal slab with a moderate index perturbation induced by thermo-optic effects. Our experimental results show that more than 60% modulation depth is achieved with only an index modulation of 0.0043.
Paper Details
Date Published: 8 March 2014
PDF: 5 pages
Proc. SPIE 8991, Optical Interconnects XIV, 89910V (8 March 2014); doi: 10.1117/12.2042431
Published in SPIE Proceedings Vol. 8991:
Optical Interconnects XIV
Henning Schröder; Ray T. Chen; Alexei L. Glebov, Editor(s)
PDF: 5 pages
Proc. SPIE 8991, Optical Interconnects XIV, 89910V (8 March 2014); doi: 10.1117/12.2042431
Show Author Affiliations
Alan X. Wang, Oregon State Univ. (United States)
Published in SPIE Proceedings Vol. 8991:
Optical Interconnects XIV
Henning Schröder; Ray T. Chen; Alexei L. Glebov, Editor(s)
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