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Proceedings Paper

Plasmonic modulator for three-dimensional chip-to-chip optical interconnects
Author(s): Fanghui Ren; Xiangyu Wang; Alan X. Wang
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Paper Abstract

We present a surface-normal plasmonic modulator structure for three-dimensional (3-D) optical interconnects using subwavelength metallic photonic crystals. Optical transmission of the metallic slab was controlled by modulating the plasmonic bandgap of the metallic photonic crystal slab with a moderate index perturbation induced by thermo-optic effects. Our experimental results show that more than 60% modulation depth is achieved with only an index modulation of 0.0043.

Paper Details

Date Published: 8 March 2014
PDF: 5 pages
Proc. SPIE 8991, Optical Interconnects XIV, 89910V (8 March 2014); doi: 10.1117/12.2042431
Show Author Affiliations
Fanghui Ren, Oregon State Univ. (United States)
Xiangyu Wang, Oregon State Univ. (United States)
Alan X. Wang, Oregon State Univ. (United States)

Published in SPIE Proceedings Vol. 8991:
Optical Interconnects XIV
Henning Schröder; Ray T. Chen; Alexei L. Glebov, Editor(s)

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