Aurrion’s heterogeneous integration process enables high performance active components such as lasers, modulators, and photodetectors to be elegantly integrated on a silicon photonics platform with high performance passive components. This platform also offers the unique capability to combine different types of active devices with separately optimized materials on the same wafer, die, and photonic integrated circuit. Similarly, devices and photonic integrated circuits operating in different wavelength bands can be formed within the same wafer and die. Experimental demonstrations show that these active components can achieve performance on par with commercially available discrete III-V components. In this paper we will discuss the advantages of Aurrion’s heterogeneous integration platform and discuss prototype demonstrations.

Date Published: 27 February 2014
PDF: 8 pages
Proc. SPIE 9002, Novel In-Plane Semiconductor Lasers XIII, 90020U (27 February 2014); doi: 10.1117/12.2042023

Published in SPIE Proceedings Vol. 9002:
Novel In-Plane Semiconductor Lasers XIII
Alexey A. Belyanin; Peter M. Smowton, Editor(s)