
Proceedings Paper
Influence of the mode field diameter on the strain sensitivity of different fibersFormat | Member Price | Non-Member Price |
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Paper Abstract
Phase sensitivities of temperature, longitudinal strain or pressure, are very important fiber features in sensing and
telecommunication applications. The most common ways to modify such sensitivities are to change the material
properties (by adjusting the core doping level) or employ microstructured fibers (which properties strongly depend on the
cross-section geometry). We decided to investigate strain sensitivity influenced by effective mode field area and mode
field diameter as clear consequence of fiber cross-section geometry.
In this paper we present the results of a three dimensional numerical analysis of the correlation between the fiber mode
field diameter and its longitudinal strain sensitivity. Both conventional and microstructured (commercially available and
custom designed) fibers are investigated. Furthermore we compare the theoretical results with experimental data. To
measure fiber sensitivity we developed a dedicated all-fiber Mach-Zehnder interferometer which enables the
measurement of strain induced phase changes in various fiber types (including conventional and microstructured fibers).
As a conclusion of our work we present relationship between strain sensitivity and MFD .
Paper Details
Date Published: 7 March 2014
PDF: 6 pages
Proc. SPIE 8982, Optical Components and Materials XI, 89821B (7 March 2014); doi: 10.1117/12.2040586
Published in SPIE Proceedings Vol. 8982:
Optical Components and Materials XI
Michel J. F. Digonnet; Shibin Jiang, Editor(s)
PDF: 6 pages
Proc. SPIE 8982, Optical Components and Materials XI, 89821B (7 March 2014); doi: 10.1117/12.2040586
Show Author Affiliations
M. Murawski, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
T. Tenderenda, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
M. Napierała, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
L. Szostkiewicz, InPhoTech Ltd. (Poland)
A. Lukowski, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
Z. Hołdyński, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
InPhoTech Ltd. (Poland)
T. Tenderenda, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
M. Napierała, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
L. Szostkiewicz, InPhoTech Ltd. (Poland)
A. Lukowski, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
Z. Hołdyński, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
M. Szymański, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
M. Słowikowski, InPhoTech Ltd. (Poland)
L. Ostrowski, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
P. Marc, Military Univ. of Technology (Poland)
L. R. Jaroszewicz, Military Univ. of Technology (Poland)
T. Nasiłowski, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
InPhoTech Ltd. (Poland)
M. Słowikowski, InPhoTech Ltd. (Poland)
L. Ostrowski, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
P. Marc, Military Univ. of Technology (Poland)
L. R. Jaroszewicz, Military Univ. of Technology (Poland)
T. Nasiłowski, Military Univ. of Technology (Poland)
InPhoTech Ltd. (Poland)
Published in SPIE Proceedings Vol. 8982:
Optical Components and Materials XI
Michel J. F. Digonnet; Shibin Jiang, Editor(s)
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