TeraXion started silicon photonics activities aiming at developing building blocks for new products and customized solutions. Passive and active devices have been developed including MMI couplers, power splitters, Bragg grating filters, high responsivity photodetectors, high speed modulators and variable optical attenuators. Packaging solutions including fiber attachment and hybrid integration using flip-chip were also developed. More specifically, a compact packaged integrated coherent receiver has been realized. Good performances were obtained as demonstrated by our system tests results showing transmission up to 4800 km with BER below hard FEC threshold. The package size is small but still limited by the electrical interface. Migrating to more compact RF interface would allow realizing the full benefit of this technology.

Date Published: 8 March 2014
PDF: 14 pages
Proc. SPIE 8988, Integrated Optics: Devices, Materials, and Technologies XVIII, 89880L (8 March 2014); doi: 10.1117/12.2036355

Published in SPIE Proceedings Vol. 8988:
Integrated Optics: Devices, Materials, and Technologies XVIII
Jean Emmanuel Broquin; Gualtiero Nunzi Conti, Editor(s)