
Proceedings Paper
Chemical inertness of UV-cured optical elastomers within the printed circuit board manufacturing process for embedded waveguide applicationsFormat | Member Price | Non-Member Price |
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Paper Abstract
Embedding polymer optical waveguides (WGs) into printed circuit boards (PCBs) for intra-board or board-to-board high
speed data communications requires polymer materials that are compatible and inert when exposed to common PCB
manufacturing processes. Ensuring both WG functionality after chemical exposure and maintaining PCB manufacturing
integrities within the production process is crucial for successful implementation. The PCB manufacturing flow is
analyzed to expose major requirements that would be required for the successful implementation of polymer materials
for embedded WG development. Chemical testing and analysis were performed on Dow Corning ® OE-4140 UV-Cured
Optical Elastomer Core and Dow Corning® OE-4141 UV-Cured Optical Elastomer Cladding which are designed for low
loss embedded optical WGs. Contamination testing was conducted to demonstrate polymer compatibility in both cured
and uncured form. Various PCB chemicals were treated with uncured polymer material and tested for effective
contamination. Fully polymerized multimode WGs were fabricated and exposed to PCB chemicals at temperatures and
durations comparable to PCB manufacturing conditions. Chemical analysis shows that the chosen polymer is compatible
and inert with most common PCB manufacturing processes.
Paper Details
Date Published: 8 March 2014
PDF: 11 pages
Proc. SPIE 8988, Integrated Optics: Devices, Materials, and Technologies XVIII, 898811 (8 March 2014); doi: 10.1117/12.2036029
Published in SPIE Proceedings Vol. 8988:
Integrated Optics: Devices, Materials, and Technologies XVIII
Jean Emmanuel Broquin; Gualtiero Nunzi Conti, Editor(s)
PDF: 11 pages
Proc. SPIE 8988, Integrated Optics: Devices, Materials, and Technologies XVIII, 898811 (8 March 2014); doi: 10.1117/12.2036029
Show Author Affiliations
Kevin Kruse, Michigan Technological Univ. (United States)
Karl Walczak, Michigan Technological Univ. (United States)
Nicholas Thomas, Calumet Electronics Corp. (United States)
Karl Walczak, Michigan Technological Univ. (United States)
Nicholas Thomas, Calumet Electronics Corp. (United States)
Brandon Swatowski, Michigan Technological Univ. (United States)
Casey Demars, Calumet Electronics Corp. (United States)
Christopher Middlebrook, Michigan Technological Univ. (United States)
Casey Demars, Calumet Electronics Corp. (United States)
Christopher Middlebrook, Michigan Technological Univ. (United States)
Published in SPIE Proceedings Vol. 8988:
Integrated Optics: Devices, Materials, and Technologies XVIII
Jean Emmanuel Broquin; Gualtiero Nunzi Conti, Editor(s)
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