
Proceedings Paper
Effect of compositional gradient on mechanical properties in aluminum/duralumin multi-layered clad structuresFormat | Member Price | Non-Member Price |
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Paper Abstract
This study aims to investigate the effect of compositional gradient on nano-, micro- and macro-mechanical
properties in aluminum (A1050)/ duralumin (A2017) multi-layered clad structures fabricated by hot rolling. Such multilayered
clad structures are possibly adopted to a new type of automobile crash boxes to effectively absorb the impact
forces generated when automobiles having collisions. 2- and 6-layered clad structures with asymmetric lay-ups from one
side of aluminum to another side of duralumin have been fabricated, which have been suffering three different heattreatments
such as (1) as-rolled (no heat-treatment), (2) annealed at 400°C and (3) homogenized at 500°C followed by
water quenching and aging (T4 heat treatment). For nano- and micro-scale mechanical properties proved by
nanoindentation, higher hardness and elastic modulus correspond to higher Cu content at the interface in annealed and
aged samples. For macro-scale mechanical properties, internal friction of 2-layered clad structures is higher than that of
6-layered clad structures in any heat-treatment samples. Deep drawing formability of annealed samples is considerably
high compared to as-rolled and aged ones.
Paper Details
Date Published: 7 December 2013
PDF: 9 pages
Proc. SPIE 8923, Micro/Nano Materials, Devices, and Systems, 89230Q (7 December 2013); doi: 10.1117/12.2033897
Published in SPIE Proceedings Vol. 8923:
Micro/Nano Materials, Devices, and Systems
James Friend; H. Hoe Tan, Editor(s)
PDF: 9 pages
Proc. SPIE 8923, Micro/Nano Materials, Devices, and Systems, 89230Q (7 December 2013); doi: 10.1117/12.2033897
Show Author Affiliations
Hisashi Sato, Nagoya Institute of Technology (Japan)
Yoshimi Watanabe, Nagoya Institute of Technology (Japan)
Yoshimi Watanabe, Nagoya Institute of Technology (Japan)
Published in SPIE Proceedings Vol. 8923:
Micro/Nano Materials, Devices, and Systems
James Friend; H. Hoe Tan, Editor(s)
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