
Proceedings Paper
Phase preservation study on ArF mask for haze-free mask resist strip and cleaningFormat | Member Price | Non-Member Price |
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Paper Abstract
Ozonated water, as an alternative to a Sulfuric – Peroxide Mixture (SPM), was introduced to the resist strip and cleaning
processes to prevent surface haze formation through the elimination of sulfuric acid from these processes. [1] [2] [3] [4] [5]
However, it also was found to cause significant change of optical characteristics and CD-linewidth shift on ArF6%
attenuation phaseshift masks (AttPSM). Although the use of 172nm Excimer UV light irradiation treatment before the
cleancouldimprove the above-mentioned shifts, after several clean cycle, this phase/CD preservation effect would be
dramatically degraded.[6] [7] [8]
In this paper, a novel approach of phase preservationto usedry treatments based on reactive plasma Asher as part of acid-free
resist strip or cleaning process is introduced. [9][10] We have investigated on the surface material integrity and CD stability
of MoSi based shifters and compared with above-mentioned approach of 172nm UV light irradiation treatment, and tried to
illustrate and explain the principle. Not only Asher process but also UV irradiation, is supposed to be kind of oxygen
activation process to accelerate oxidization on MoSi based shifter of ArF AttPSM masks, and created passivation layer
would stand out for wet cleaning; furthermore, plasma Asher process is in prior to UV irradiation. As shown in Cross-section
profiles on the masks without and with Asher process, although the deference is very limited, it may be proved that a thin
passivation layer was created on the surface and side of MoSi based shifter after Asher process.
Paper Details
Date Published: 9 September 2013
PDF: 10 pages
Proc. SPIE 8880, Photomask Technology 2013, 88801L (9 September 2013); doi: 10.1117/12.2023019
Published in SPIE Proceedings Vol. 8880:
Photomask Technology 2013
Thomas B. Faure; Paul W. Ackmann, Editor(s)
PDF: 10 pages
Proc. SPIE 8880, Photomask Technology 2013, 88801L (9 September 2013); doi: 10.1117/12.2023019
Show Author Affiliations
Irene Shi, Semiconductor Manufacturing International Corp. (China)
Eric Guo, Semiconductor Manufacturing International Corp. (China)
Eric Tian, Semiconductor Manufacturing International Corp. (China)
Tracy Gu, Semiconductor Manufacturing International Corp. (China)
Eric Guo, Semiconductor Manufacturing International Corp. (China)
Eric Tian, Semiconductor Manufacturing International Corp. (China)
Tracy Gu, Semiconductor Manufacturing International Corp. (China)
Forrest Jiang, Semiconductor Manufacturing International Corp. (China)
Sandy Qian, Semiconductor Manufacturing International Corp. (China)
Daisuke Matsushima, Shibaura Mechatronics Corp. (Japan)
Jinyuan Pang, Shibaura Mechatronics Corp. (Japan)
Sandy Qian, Semiconductor Manufacturing International Corp. (China)
Daisuke Matsushima, Shibaura Mechatronics Corp. (Japan)
Jinyuan Pang, Shibaura Mechatronics Corp. (Japan)
Published in SPIE Proceedings Vol. 8880:
Photomask Technology 2013
Thomas B. Faure; Paul W. Ackmann, Editor(s)
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