
Proceedings Paper
Sub-nanometer in-die overlay metrology: measurement and simulation at the edge of finitenessFormat | Member Price | Non-Member Price |
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Paper Abstract
The target size reduction for overlay metrology is driven by the optimization of the device area. Furthermore, for the
future semiconductor nodes accurate metrology on the order of 0.2 nm is necessary locally in the device area, requiring
small in-die targets that fit within the product structures on the wafer. In this, the diffraction-based overlay metrology
using optical scatterometry is challenged to extreme limits. The small grating cannot be considered as an infinitely
repeating line-space structure with a sharply peaked spectrum, however a continuous spectrum is observed. Also,
metrology proximity effects due to the environment near the metrology target need to be taken into account. On the one
hand, this sets strict design and assembly rules of the metrology sensor. On the other hand, the optical ray-based analysis
is extended to wave-based analysis to capture the full extent of the overlay application and sensor. In this publication, the
challenges of sub-nanometer in-die overlay metrology are addressed, including measurements and simulations.
Paper Details
Date Published: 13 May 2013
PDF: 6 pages
Proc. SPIE 8788, Optical Measurement Systems for Industrial Inspection VIII, 87881N (13 May 2013); doi: 10.1117/12.2020930
Published in SPIE Proceedings Vol. 8788:
Optical Measurement Systems for Industrial Inspection VIII
Peter H. Lehmann; Wolfgang Osten; Armando Albertazzi, Editor(s)
PDF: 6 pages
Proc. SPIE 8788, Optical Measurement Systems for Industrial Inspection VIII, 87881N (13 May 2013); doi: 10.1117/12.2020930
Show Author Affiliations
Henk-Jan H. Smilde, ASML Netherlands B.V. (Netherlands)
Martin Jak, ASML Netherlands B.V. (Netherlands)
Arie den Boef, ASML Netherlands B.V. (Netherlands)
Mark van Schijndel, ASML Netherlands B.V. (Netherlands)
Murat Bozkurt, ASML Netherlands B.V. (Netherlands)
Andreas Fuchs, ASML Netherlands B.V. (Netherlands)
Maurits van der Schaar, ASML Netherlands B.V. (Netherlands)
Martin Jak, ASML Netherlands B.V. (Netherlands)
Arie den Boef, ASML Netherlands B.V. (Netherlands)
Mark van Schijndel, ASML Netherlands B.V. (Netherlands)
Murat Bozkurt, ASML Netherlands B.V. (Netherlands)
Andreas Fuchs, ASML Netherlands B.V. (Netherlands)
Maurits van der Schaar, ASML Netherlands B.V. (Netherlands)
Steffen Meyer, ASML Netherlands B.V. (Netherlands)
Stephen Morgan, ASML Netherlands B.V. (Netherlands)
Kaustuve Bhattacharyya, ASML Netherlands B.V. (Netherlands)
Guo-Tsai Huang, TSMC Ltd. (Taiwan)
Chih-Ming Ke, TSMC Ltd. (Taiwan)
Kai-Hsiung Chen, TSMC Ltd. (Taiwan)
Stephen Morgan, ASML Netherlands B.V. (Netherlands)
Kaustuve Bhattacharyya, ASML Netherlands B.V. (Netherlands)
Guo-Tsai Huang, TSMC Ltd. (Taiwan)
Chih-Ming Ke, TSMC Ltd. (Taiwan)
Kai-Hsiung Chen, TSMC Ltd. (Taiwan)
Published in SPIE Proceedings Vol. 8788:
Optical Measurement Systems for Industrial Inspection VIII
Peter H. Lehmann; Wolfgang Osten; Armando Albertazzi, Editor(s)
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