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Proceedings Paper

Chip leveling and focusing with laser interferometry
Author(s): Yoshitada Oshida; Minoru Tanaka; Tetsuzou Tanimoto; Toshiei Kurosaki
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Paper Abstract

A new chip leveling and focusing method has been developed which uses interferometry with a laser beam which has S-polarization and a large incident angle to the exposure surface of an LSI wafer and thereby leveling and focusing accuracy is maintained regardless of the kinds of layers on the wafer. A pilot model of this type of detection method demonstrated a leveling and focusing accuracy of about and 1.

Paper Details

Date Published: 1 June 1990
PDF: 8 pages
Proc. SPIE 1264, Optical/Laser Microlithography III, (1 June 1990); doi: 10.1117/12.20192
Show Author Affiliations
Yoshitada Oshida, Hitachi, Ltd. (Japan)
Minoru Tanaka, Hitachi, Ltd. (Japan)
Tetsuzou Tanimoto, Hitachi, Ltd. (Japan)
Toshiei Kurosaki, Hitachi, Ltd. (Japan)

Published in SPIE Proceedings Vol. 1264:
Optical/Laser Microlithography III
Victor Pol, Editor(s)

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