
Proceedings Paper
Mid-infrared rib waveguide absorption sensors based on SiFormat | Member Price | Non-Member Price |
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Paper Abstract
We present a silicon (Si) based infrared (IR) absorption sensor which is suitable for integration into a
miniaturized sensor system. The sensor is designed to operate in the wavelength region around λ=5 μm. We particularly
discuss the design, the modeling and the optical characterization of the used materials. The sensor operates as a singlemode
Si waveguide (WG) on low refractive index Si3N4 membrane. The single-mode requirement for the WG is needed
to avoid losses due to imperfections on the WG walls causing redistribution of the carried energy among the different
modes. The waveguide interacts with the sample by means of the evanescent field which extends into the sample. This
sensor configuration is not only compatible to the Si technology, but can also be realized on a single chip. In addition,
the principle of operation is not limited to a single wavelength: by changing the waveguide dimensions, it can be applied
to a broad spectral range. Thus, by its dimensions, performance and Si-compatibility, the sensor is expected to overcome
previously published device concepts.
The single-mode requirements lead to WG dimensions of 2 μm width x 600 nm height for an operation at λ=5 μm, which
are verified by 3D simulations. For those parameters, the WG will support one transverse electric (TE) mode and one
transverse magnetic (TM) mode. Efficient guidance is only obtained for the fundamental TE and TM modes. As an
example, it is shown that mode TE1 is a non-guided mode. The experimentally obtained WG dimensions are 605 nm
height and 2 μm width. In our paper we discuss issues with the design, the material characterization and first
experimental results obtained with the recently fabricated prototypes.
Paper Details
Date Published: 17 May 2013
PDF: 7 pages
Proc. SPIE 8763, Smart Sensors, Actuators, and MEMS VI, 87632F (17 May 2013); doi: 10.1117/12.2017273
Published in SPIE Proceedings Vol. 8763:
Smart Sensors, Actuators, and MEMS VI
Ulrich Schmid; José Luis Sánchez de Rojas Aldavero; Monika Leester-Schaedel, Editor(s)
PDF: 7 pages
Proc. SPIE 8763, Smart Sensors, Actuators, and MEMS VI, 87632F (17 May 2013); doi: 10.1117/12.2017273
Show Author Affiliations
Ventsislav Lavchiev, Johannes Kepler Univ. (Austria)
Christian Kristament, Vienna Univ. of Technology (Austria)
Markus Brandstetter, Vienna Univ. of Technology (Austria)
Georg Ramer, Vienna Univ. of Technology (Austria)
Bernhard Lendl, Vienna Univ. of Technology (Austria)
Christian Kristament, Vienna Univ. of Technology (Austria)
Markus Brandstetter, Vienna Univ. of Technology (Austria)
Georg Ramer, Vienna Univ. of Technology (Austria)
Bernhard Lendl, Vienna Univ. of Technology (Austria)
Ursula Hedenig, Infineon Technologies Austria AG (Austria)
Thomas Grille, Infineon Technologies Austria AG (Austria)
Peter Irsigler, Infineon Technologies Austria AG (Austria)
Bernhard Jakoby, Johannes Kepler Univ. (Austria)
Thomas Grille, Infineon Technologies Austria AG (Austria)
Peter Irsigler, Infineon Technologies Austria AG (Austria)
Bernhard Jakoby, Johannes Kepler Univ. (Austria)
Published in SPIE Proceedings Vol. 8763:
Smart Sensors, Actuators, and MEMS VI
Ulrich Schmid; José Luis Sánchez de Rojas Aldavero; Monika Leester-Schaedel, Editor(s)
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