
Proceedings Paper
A large deflection model of silicon membranes for testing intrinsic stress of MEMS microphones by measuring pull-In voltageFormat | Member Price | Non-Member Price |
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Paper Abstract
Mechanical parameters, especially mechanical stress of membranes used in silicon microphones strongly depend
on the manufacturing process. As a result, deviations during this process can result in sensitivity variations
of the microphone. Therefore, the stress should be well controlled within a certain tensile level. This paper
describes a method to test devices electrically using the MEMS related pull-in phenomenon with respect to the
mechanical compliance of microphone membranes. Using this method, out of specification chips can be detected
at an early stage within the manufacturing process instead of determination at a system functionality test after
packaging. Therefore, the adequacy for the intended use of the pull-in voltage and its dependency on varying
tensile stress due to manufacturing tolerance is evaluated.
Paper Details
Date Published: 17 May 2013
PDF: 11 pages
Proc. SPIE 8763, Smart Sensors, Actuators, and MEMS VI, 876326 (17 May 2013); doi: 10.1117/12.2016835
Published in SPIE Proceedings Vol. 8763:
Smart Sensors, Actuators, and MEMS VI
Ulrich Schmid; José Luis Sánchez de Rojas Aldavero; Monika Leester-Schaedel, Editor(s)
PDF: 11 pages
Proc. SPIE 8763, Smart Sensors, Actuators, and MEMS VI, 876326 (17 May 2013); doi: 10.1117/12.2016835
Show Author Affiliations
Florian Oesterle, Univ. of Erlangen-Nuremberg (Germany)
Franz Fink, Infineon Technologies AG (Germany)
Harald Kuhn, Infineon Technologies AG (Germany)
Franz Fink, Infineon Technologies AG (Germany)
Harald Kuhn, Infineon Technologies AG (Germany)
Alfons Dehé, Infineon Technologies AG (Germany)
Robert Weigel, Univ. of Erlangen-Nuremberg (Germany)
Alexander Koelpin, Univ. of Erlangen-Nuremberg (Germany)
Robert Weigel, Univ. of Erlangen-Nuremberg (Germany)
Alexander Koelpin, Univ. of Erlangen-Nuremberg (Germany)
Published in SPIE Proceedings Vol. 8763:
Smart Sensors, Actuators, and MEMS VI
Ulrich Schmid; José Luis Sánchez de Rojas Aldavero; Monika Leester-Schaedel, Editor(s)
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