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Proceedings Paper

Flexible digital x-ray technology for far-forward remote diagnostic and conformal x-ray imaging applications
Author(s): Joseph Smith; Michael Marrs; Mark Strnad; Raj B. Apte; Julie Bert; David Allee; Nicholas Colaneri; Eric Forsythe; David Morton
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Paper Abstract

Today’s flat panel digital x-ray image sensors, which have been in production since the mid-1990s, are produced exclusively on glass substrates. While acceptable for use in a hospital or doctor’s office, conventional glass substrate digital x-ray sensors are too fragile for use outside these controlled environments without extensive reinforcement. Reinforcement, however, significantly increases weight, bulk, and cost, making them impractical for far-forward remote diagnostic applications, which demand rugged and lightweight x-ray detectors. Additionally, glass substrate x-ray detectors are inherently rigid. This limits their use in curved or bendable, conformal x-ray imaging applications such as the non-destructive testing (NDT) of oil pipelines. However, by extending low-temperature thin-film transistor (TFT) technology previously demonstrated on plastic substrate- based electrophoretic and organic light emitting diode (OLED) flexible displays, it is now possible to manufacture durable, lightweight, as well as flexible digital x-ray detectors. In this paper, we discuss the principal technical approaches used to apply flexible display technology to two new large-area flexible digital x-ray sensors for defense, security, and industrial applications and demonstrate their imaging capabilities. Our results include a 4.8″ diagonal, 353 x 463 resolution, flexible digital x-ray detector, fabricated on a 6″ polyethylene naphthalate (PEN) plastic substrate; and a larger, 7.9″ diagonal, 720 x 640 resolution, flexible digital x-ray detector also fabricated on PEN and manufactured on a gen 2 (370 x 470 mm) substrate.

Paper Details

Date Published: 29 May 2013
PDF: 7 pages
Proc. SPIE 8730, Flexible Electronics, 87300F (29 May 2013); doi: 10.1117/12.2016102
Show Author Affiliations
Joseph Smith, Arizona State Univ. (United States)
Michael Marrs, Arizona State Univ. (United States)
Mark Strnad, Arizona State Univ. (United States)
Raj B. Apte, Palo Alto Research Ctr., Inc. (United States)
Julie Bert, Palo Alto Research Ctr., Inc. (United States)
David Allee, Arizona State Univ. (United States)
Nicholas Colaneri, Arizona State Univ. (United States)
Eric Forsythe, U.S. Army Research Lab. (United States)
David Morton, U.S. Army Research Lab. (United States)

Published in SPIE Proceedings Vol. 8730:
Flexible Electronics
David R. Allee; Eric W. Forsythe, Editor(s)

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