
Proceedings Paper
Wafer-level reliability characterization for wafer-level packaged microbolometer with ultra-small array sizeFormat | Member Price | Non-Member Price |
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Paper Abstract
For the development of small and low cost microbolometer, wafer level reliability characterization techniques of vacuum
packaged wafer are introduced. Amorphous silicon based microbolometer-type vacuum sensors fabricated in 8 inch
wafer are bonded with cap wafer by Au-Sn eutectic solder. Membrane deflection and integrated vacuum sensor
techniques are independently used to characterize the hermeticity in a wafer-level. For the packaged wafer with
membrane thickness below 100um, it is possible to determine the hermeticity as screening test by optical detection
technique. Integrated vacuum sensor having the same structure as bolometer pixel shows the vacuum level below
100mTorr. All steps from packaging process to fine hermeticity test are implemented in wafer level to prove the high
volume and low cost production.
Paper Details
Date Published: 19 June 2013
PDF: 9 pages
Proc. SPIE 8704, Infrared Technology and Applications XXXIX, 87043E (19 June 2013); doi: 10.1117/12.2015738
Published in SPIE Proceedings Vol. 8704:
Infrared Technology and Applications XXXIX
Bjørn F. Andresen; Gabor F. Fulop; Charles M. Hanson; Paul R. Norton; Patrick Robert, Editor(s)
PDF: 9 pages
Proc. SPIE 8704, Infrared Technology and Applications XXXIX, 87043E (19 June 2013); doi: 10.1117/12.2015738
Show Author Affiliations
Hee Yeoun Kim, National Nanofab Ctr. (Korea, Republic of)
Chungmo Yang, National Nanofab Ctr. (Korea, Republic of)
Jae Hong Park, National Nanofab Ctr. (Korea, Republic of)
Ho Jung, National Nanofab Ctr. (Korea, Republic of)
Taehyun Kim, National Nanofab Ctr. (Korea, Republic of)
Kyung Tae Kim, National Nanofab Ctr. (Korea, Republic of)
Chungmo Yang, National Nanofab Ctr. (Korea, Republic of)
Jae Hong Park, National Nanofab Ctr. (Korea, Republic of)
Ho Jung, National Nanofab Ctr. (Korea, Republic of)
Taehyun Kim, National Nanofab Ctr. (Korea, Republic of)
Kyung Tae Kim, National Nanofab Ctr. (Korea, Republic of)
Sung Kyu Lim, National Nanofab Ctr. (Korea, Republic of)
Sang Woo Lee, ePack Inc. (United States)
Jay Mitchell, ePack, Inc. (United States)
Wook Joong Hwang, National Nanofab Ctr. (Korea, Republic of)
Kwyro Lee, National Nanofab Ctr. (Korea, Republic of)
Sang Woo Lee, ePack Inc. (United States)
Jay Mitchell, ePack, Inc. (United States)
Wook Joong Hwang, National Nanofab Ctr. (Korea, Republic of)
Kwyro Lee, National Nanofab Ctr. (Korea, Republic of)
Published in SPIE Proceedings Vol. 8704:
Infrared Technology and Applications XXXIX
Bjørn F. Andresen; Gabor F. Fulop; Charles M. Hanson; Paul R. Norton; Patrick Robert, Editor(s)
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