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Proceedings Paper

Wafer-level reliability characterization for wafer-level packaged microbolometer with ultra-small array size
Author(s): Hee Yeoun Kim; Chungmo Yang; Jae Hong Park; Ho Jung; Taehyun Kim; Kyung Tae Kim; Sung Kyu Lim; Sang Woo Lee; Jay Mitchell; Wook Joong Hwang; Kwyro Lee
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Paper Abstract

For the development of small and low cost microbolometer, wafer level reliability characterization techniques of vacuum packaged wafer are introduced. Amorphous silicon based microbolometer-type vacuum sensors fabricated in 8 inch wafer are bonded with cap wafer by Au-Sn eutectic solder. Membrane deflection and integrated vacuum sensor techniques are independently used to characterize the hermeticity in a wafer-level. For the packaged wafer with membrane thickness below 100um, it is possible to determine the hermeticity as screening test by optical detection technique. Integrated vacuum sensor having the same structure as bolometer pixel shows the vacuum level below 100mTorr. All steps from packaging process to fine hermeticity test are implemented in wafer level to prove the high volume and low cost production.

Paper Details

Date Published: 19 June 2013
PDF: 9 pages
Proc. SPIE 8704, Infrared Technology and Applications XXXIX, 87043E (19 June 2013); doi: 10.1117/12.2015738
Show Author Affiliations
Hee Yeoun Kim, National Nanofab Ctr. (Korea, Republic of)
Chungmo Yang, National Nanofab Ctr. (Korea, Republic of)
Jae Hong Park, National Nanofab Ctr. (Korea, Republic of)
Ho Jung, National Nanofab Ctr. (Korea, Republic of)
Taehyun Kim, National Nanofab Ctr. (Korea, Republic of)
Kyung Tae Kim, National Nanofab Ctr. (Korea, Republic of)
Sung Kyu Lim, National Nanofab Ctr. (Korea, Republic of)
Sang Woo Lee, ePack Inc. (United States)
Jay Mitchell, ePack, Inc. (United States)
Wook Joong Hwang, National Nanofab Ctr. (Korea, Republic of)
Kwyro Lee, National Nanofab Ctr. (Korea, Republic of)

Published in SPIE Proceedings Vol. 8704:
Infrared Technology and Applications XXXIX
Bjørn F. Andresen; Gabor F. Fulop; Charles M. Hanson; Paul R. Norton; Patrick Robert, Editor(s)

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