Proceedings Paper
Low-cost compact thermal imaging sensors for body temperature measurement| Format | Member Price | Non-Member Price |
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Paper Abstract
This paper presents a 32x32 microbolometer thermal imaging sensor for human body temperature measurement. Waferlevel
vacuum packaging technology allows us to get a low cost and compact imaging sensor chip. The microbolometer
uses V-W-O film as sensing material and ROIC has been designed 0.35-um CMOS process in UMC. A thermal image of
a human face and a hand using f/1 lens convinces that it has a potential of human body temperature for commercial use.
Paper Details
Date Published: 11 June 2013
PDF: 7 pages
Proc. SPIE 8704, Infrared Technology and Applications XXXIX, 87041O (11 June 2013); doi: 10.1117/12.2015662
Published in SPIE Proceedings Vol. 8704:
Infrared Technology and Applications XXXIX
Bjørn F. Andresen; Gabor F. Fulop; Charles M. Hanson; Paul R. Norton; Patrick Robert, Editor(s)
PDF: 7 pages
Proc. SPIE 8704, Infrared Technology and Applications XXXIX, 87041O (11 June 2013); doi: 10.1117/12.2015662
Show Author Affiliations
Myung-Soo Han, Korea Photonics Technology Institute (Korea, Republic of)
Seok Man Han, Korea Photonics Technology Institute (Korea, Republic of)
Hyo Jin Kim, Korea Photonics Technology Institute (Korea, Republic of)
Jae Chul Shin, Korea Photonics Technology Institute (Korea, Republic of)
Seok Man Han, Korea Photonics Technology Institute (Korea, Republic of)
Hyo Jin Kim, Korea Photonics Technology Institute (Korea, Republic of)
Jae Chul Shin, Korea Photonics Technology Institute (Korea, Republic of)
Mi Sook Ahn, U Electronics (Korea, Republic of)
Hyung Won Kim, U Electronics (Korea, Republic of)
Yong Hee Han, U Electronics (Korea, Republic of)
Hyung Won Kim, U Electronics (Korea, Republic of)
Yong Hee Han, U Electronics (Korea, Republic of)
Published in SPIE Proceedings Vol. 8704:
Infrared Technology and Applications XXXIX
Bjørn F. Andresen; Gabor F. Fulop; Charles M. Hanson; Paul R. Norton; Patrick Robert, Editor(s)
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