
Proceedings Paper • Open Access
The evolving complexity of patterning materials
Paper Abstract
People have enjoyed innovations which are made possible with the device scaling. The industry has been challenging to realize the Moore’s Law. Resolution limit of ArF immersion scanner has already been larger than the device CD necessary now. Device structures have been getting more and more complicated to meet various technology requirements such as scaling, device speed, low power consumption and so on. Not only the scaling but also complication has to be overcome to realize those requirements. Scaling requirements, device structure, and new types of architectures for new generation device with the limited single exposure capability force us to keep using and exploring complicated multi-step patterning techniques or “tricks”. Device design, elements, process, and consumable tricks and JSR’s solution have been reviewed.
Paper Details
Date Published: 10 April 2013
PDF: 6 pages
Proc. SPIE 8682, Advances in Resist Materials and Processing Technology XXX, 868202 (10 April 2013); doi: 10.1117/12.2014526
Published in SPIE Proceedings Vol. 8682:
Advances in Resist Materials and Processing Technology XXX
Mark H. Somervell, Editor(s)
PDF: 6 pages
Proc. SPIE 8682, Advances in Resist Materials and Processing Technology XXX, 868202 (10 April 2013); doi: 10.1117/12.2014526
Show Author Affiliations
Tsutomu Shimokawa, JSR Corp. (Japan)
Yoshi Hishiro, JSR Micro, Inc. (United States)
Yoshikazu Yamaguchi, JSR Corp. (Japan)
Motoyuki Shima, JSR Corp. (Japan)
Yoshi Hishiro, JSR Micro, Inc. (United States)
Yoshikazu Yamaguchi, JSR Corp. (Japan)
Motoyuki Shima, JSR Corp. (Japan)
Published in SPIE Proceedings Vol. 8682:
Advances in Resist Materials and Processing Technology XXX
Mark H. Somervell, Editor(s)
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