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Proceedings Paper

Progress in directed self-assembly hole shrink applications
Author(s): Todd R. Younkin; Roel Gronheid; Paulina Rincon Delgadillo; Boon Teik Chan; Nadia Vandenbroeck; Steven Demuynck; Ainhoa Romo-Negreira; Doni Parnell; Kathleen Nafus; Shigeru Tahara; Mark Somervell
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Paper Abstract

Directed Self-Assembly (DSA) has become a promising alternative for generating fine lithographic patterns. Since contact holes are among the most difficult structures to resolve through traditional lithographic means, directed selfassembly applications that generate smaller contact holes are of particular interest to the industry. In this paper, DSA integrations that shrink pre-patterned contact holes were explored. The use of both block copolymers (BCPs)1 and blended polymer systems2 was considered. In addition, both wet3 and dry4 techniques were used to develop the central core out of the respective phase-separated morphologies. Finally, the hole patterns created through the various contact hole applications were transferred to substrates of interest with the goal of incorporating them into an IMEC 28 nm node via chain electrical test vehicle for direct, side-by-side comparison.

Paper Details

Date Published: 29 March 2013
PDF: 11 pages
Proc. SPIE 8682, Advances in Resist Materials and Processing Technology XXX, 86820L (29 March 2013); doi: 10.1117/12.2012353
Show Author Affiliations
Todd R. Younkin, Intel Corp. (United States)
IMEC (Belgium)
Roel Gronheid, IMEC (Belgium)
Paulina Rincon Delgadillo, IMEC (Belgium)
The Univ. of Chicago (United States)
Boon Teik Chan, IMEC (Belgium)
Nadia Vandenbroeck, IMEC (Belgium)
Steven Demuynck, IMEC (Belgium)
Ainhoa Romo-Negreira, IMEC (Belgium)
Tokyo Electron Europe (Netherlands)
Doni Parnell, IMEC (Belgium)
Tokyo Electron Europe (Netherlands)
Kathleen Nafus, IMEC (Belgium)
Tokyo Electron Europe (Netherlands)
Shigeru Tahara, IMEC (Belgium)
Tokyo Electron Miyagi Ltd. (Japan)
Mark Somervell, Tokyo Electron America, Inc. (United States)

Published in SPIE Proceedings Vol. 8682:
Advances in Resist Materials and Processing Technology XXX
Mark H. Somervell, Editor(s)

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