Share Email Print

Proceedings Paper

A novel 3D algorithm for VLSI floorplanning
Author(s): D. Gracia Nirmala Rani; S. Rajaram; Athira Sudarasan
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

3-D VLSI circuit is becoming a hot issue because of its potential of enhancing performance, while it is also facing challenges such as the increased complexity on floorplanning and placement in VLSI Physical design. Efficient 3-D floorplan representations are needed to handle the placement optimization in new circuit designs. We analyze and categorize some state-of-the-art 3-D representations, and propose a Ternary tree model for 3-D nonslicing floorplans, extending the B*tree from 2D.This paper proposes a novel optimization algorithm for packing of 3D rectangular blocks. The new techniques considered are Differential evolutionary algorithm (DE) is very fast in that it evaluates the feasibility of a Ternary tree representation. Experimental results based on MCNC benchmark with constraints show that our proposed Differential Evolutionary (DE) can quickly produce optimal solutions.

Paper Details

Date Published: 28 January 2013
PDF: 5 pages
Proc. SPIE 8760, International Conference on Communication and Electronics System Design, 87601S (28 January 2013); doi: 10.1117/12.2012334
Show Author Affiliations
D. Gracia Nirmala Rani, Thiagarajar College of Engineering (India)
S. Rajaram, Thiagarajar College of Engineering (India)
Athira Sudarasan, Thiagarajar College of Engineering (India)

Published in SPIE Proceedings Vol. 8760:
International Conference on Communication and Electronics System Design
Vijay Janyani; M. Salim; K. K. Sharma, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?