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Proceedings Paper

3D RF integration at VTT
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Paper Abstract

Integration of multiple chips and functions to the same radio module is a key issue when the size of a radio front-end is tried to minimize. VTT Technical Research Centre of Finland has developed both Low Temperature Co-fired Ceramics (LTCC) and Integrated Passive Devices (IPD) integration platforms for radio frequency (RF) integrated modules. Three dimensional (3D) integration technologies are enablers for realizing compact multi-chip modules with several different technologies in the same module. In addition to module level integration, both technologies are used for realizing high quality factor passive components.

Paper Details

Date Published: 9 April 2013
PDF: 7 pages
Proc. SPIE 8691, Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2013, 86910V (9 April 2013); doi: 10.1117/12.2012001
Show Author Affiliations
Tauno Vähä-Heikkilä, VTT Technical Research Ctr. of Finland (Finland)

Published in SPIE Proceedings Vol. 8691:
Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2013
Vijay K. Varadan, Editor(s)

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