
Proceedings Paper
Preliminary investigation of shot noise, dose, and focus latitude for e-beam direct writeFormat | Member Price | Non-Member Price |
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Paper Abstract
Maskless electron beam lithography can potentially extend semiconductor manufacturing to the 10 nm
logic (16 nm half pitch) technology node and beyond. KLA-Tencor is developing Reflective Electron Beam
Lithography (REBL) technology targeting high-volume 10 nm logic performance.
There are several potential applications for E-Beam Direct Write Lithography in high volume
manufacturing (HVM) Lithography. They range from writing full critical layers to the use as complementary
lithography in order to write cut masks for multiple patterning optical lithography. Two of the potential applications
for REBL with specific requirements on the writing strategy are contact layer and cut mask lithography. For these
two applications the number of electrons writing a single feature can be a concern if the resist sensitivity is high and
the process latitude is small. This paper will share calculations with respect to the needed and expected shot noise,
dose and focus latitude performance of a proposed REBL lithography system. The simulated results will be
compared to data taken on test structures. Predicted performance based on the simulations and test results of a
potential REBL system for contact layers and cut mask applications will be discussed.
Paper Details
Date Published: 26 March 2013
PDF: 7 pages
Proc. SPIE 8680, Alternative Lithographic Technologies V, 868029 (26 March 2013); doi: 10.1117/12.2011908
Published in SPIE Proceedings Vol. 8680:
Alternative Lithographic Technologies V
William M. Tong, Editor(s)
PDF: 7 pages
Proc. SPIE 8680, Alternative Lithographic Technologies V, 868029 (26 March 2013); doi: 10.1117/12.2011908
Show Author Affiliations
Alan Brodie, KLA-Tencor Corp. (United States)
Shinichi Kojima, KLA-Tencor Corp. (United States)
Mark McCord, KLA-Tencor Corp. (United States)
Shinichi Kojima, KLA-Tencor Corp. (United States)
Mark McCord, KLA-Tencor Corp. (United States)
Luca Grella, KLA-Tencor Corp. (United States)
Thomas Gubiotti, KLA-Tencor Corp. (United States)
Chris Bevis, KLA-Tencor Corp. (United States)
Thomas Gubiotti, KLA-Tencor Corp. (United States)
Chris Bevis, KLA-Tencor Corp. (United States)
Published in SPIE Proceedings Vol. 8680:
Alternative Lithographic Technologies V
William M. Tong, Editor(s)
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