Self-aligned double patterning (SADP) has become a promising technique to push pattern resolution limit to sub-22nm technology node. Although SADP provides good overlay controllability, it encounters many challenges in physical design stages to obtain conflict-free layout decomposition. In this paper, we study the impact on placement by different standard cell layout decomposition strategies. We propose a SADP friendly standard cell configuration which provides pre-coloring results for standard cells. These configurations are brought into the placement stage to help ensure layout decomposability and save the extra effort for solving conflicts in later stages.

Date Published: 29 March 2013
PDF: 10 pages
Proc. SPIE 8684, Design for Manufacturability through Design-Process Integration VII, 868406 (29 March 2013); doi: 10.1117/12.2011660

Published in SPIE Proceedings Vol. 8684:
Design for Manufacturability through Design-Process Integration VII
Mark E. Mason; John L. Sturtevant, Editor(s)