
Proceedings Paper
Using process monitor wafers to understand directed self-assembly defectsFormat | Member Price | Non-Member Price |
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Paper Abstract
As directed self-assembly (DSA) has gained momentum over the past few years, questions about its application to high
volume manufacturing have arisen. One of the major concerns is about the fundamental limits of defectivity that can be attained with the technology. If DSA applications demonstrate defectivity that rivals of traditional lithographic
technologies, the pathway to the cost benefits of the technology creates a very compelling case for its large scale
implementation. To address this critical question, our team at IMEC has established a process monitor flow to track the
defectivity behaviors of an exemplary chemo-epitaxy application for printing line/space patterns. Through establishing
this baseline, we have been able to understand both traditional lithographic defect sources in new materials as well as
new classes of assembly defects associated with DSA technology. Moreover, we have explored new materials and
processing to lower the level of the defectivity baseline. The robustness of the material sets and process is investigated
as well. In this paper, we will report the understandings learned from the IMEC DSA process monitor flow.
Paper Details
Date Published: 26 March 2013
PDF: 7 pages
Proc. SPIE 8680, Alternative Lithographic Technologies V, 86801S (26 March 2013); doi: 10.1117/12.2011658
Published in SPIE Proceedings Vol. 8680:
Alternative Lithographic Technologies V
William M. Tong, Editor(s)
PDF: 7 pages
Proc. SPIE 8680, Alternative Lithographic Technologies V, 86801S (26 March 2013); doi: 10.1117/12.2011658
Show Author Affiliations
Yi Cao, AZ Electronic Materials (United States)
YoungJun Her, AZ Electronic Materials (United States)
Paulina Rincon Delgadillo, Univ. of Chicago (United States)
Nadia Vandenbroeck, IMEC (Belgium)
Roel Gronheid, IMEC (Belgium)
Boon Teik Chan, IMEC (Belgium)
YoungJun Her, AZ Electronic Materials (United States)
Paulina Rincon Delgadillo, Univ. of Chicago (United States)
Nadia Vandenbroeck, IMEC (Belgium)
Roel Gronheid, IMEC (Belgium)
Boon Teik Chan, IMEC (Belgium)
Yukio Hashimoto, Nihon Entegris K. K. (Japan)
Ainhoa Romo, Tokyo Electron America, Inc. (United States)
Mark Somervell, Tokyo Electron America, Inc. (United States)
Kathleen Nafus, Tokyo Electron America, Inc. (United States)
Paul F. Nealey, Univ. of Chicago (United States)
Ainhoa Romo, Tokyo Electron America, Inc. (United States)
Mark Somervell, Tokyo Electron America, Inc. (United States)
Kathleen Nafus, Tokyo Electron America, Inc. (United States)
Paul F. Nealey, Univ. of Chicago (United States)
Published in SPIE Proceedings Vol. 8680:
Alternative Lithographic Technologies V
William M. Tong, Editor(s)
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