Share Email Print

Proceedings Paper

The challenges encountered in the integration of an early test wafer surface scanning inspection system into a 450mm manufacturing line
Author(s): Jeffrey Lee; Steve McGarvey
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

The introduction of early test wafer (ETW) 450mm Surface Scanning Inspection Systems (SSIS) into Si manufacturing has brought with it numerous technical, commercial, and logistical challenges on the path to rapid recipe development and subsequent qualification of other 450mm wafer processing equipment. This paper will explore the feasibility of eliminating the Polystyrene Latex Sphere deposition process step and the subsequent creation of SSIS recipes based upon the theoretical optical properties of both the SSIS and the process film stack(s). The process of Polystyrene Latex Sphere deposition for SSIS recipe generation and development is generally accepted on the previous technology nodes for 150/200/300mm wafers. PSL is deposited with a commercially available deposition system onto a non-patterned bare Si or non-patterned filmed Si wafer. After deposition of multiple PSL spots, located in different positions on a wafer, the wafer is inspected on a SSIS and a response curve is generated. The response curve is based on the the light scattering intensity of the NIST certified PSL that was deposited on the wafer. As the initial 450mm Si wafer manufacturing began, there were no inspection systems with sub-90nm sensitivities available for defect and haze level verification. The introduction of a 450mm sub-30nm inspection system into the manufacturing line generated instant challenges. Whereas the 450mm wafers were relatively defect free at 90nm, at 40nm the wafers contained several hundred thousand defects. When PSL was deposited onto wafers with these kinds of defect levels, PSL with signals less than the sub-90nm defects were difficult to extract. As the defectivity level of the wafers from the Si suppliers rapidly improves the challenges of SSIS recipe creation with high defectivity decreases while at the same time the cost of PSL deposition increases. The current cost per wafer is fifteen thousand dollars for a 450mm PSL deposition service. When viewed from the standpoint of the generations of hundreds of SSIS recipes for the global member companies of ISMI, it is simply not economically viable to create all recipes based on PSL based light scattering response curves. This paper will explore the challenges/end results encountered with the PSL based SSIS recipe generation and compare those against the challenges/end results of SSIS recipes generated based strictly upon theoretical Bidirectional reflectance distribution function (BRDF) light scattering modeling. The BRDF modeling will allow for the creation of SSIS recipes without PSL deposition, which is greatly appealing for a multitude of both technical and commercial considerations. This paper will also explore the technical challenges of SSIS recipe generation based strictly upon BRDF modeling.

Paper Details

Date Published: 10 April 2013
PDF: 11 pages
Proc. SPIE 8681, Metrology, Inspection, and Process Control for Microlithography XXVII, 86811V (10 April 2013); doi: 10.1117/12.2011646
Show Author Affiliations
Jeffrey Lee, Global 450 Consortium (G450C) (United States)
Steve McGarvey, Hitachi High Technologies America, Inc. (United States)

Published in SPIE Proceedings Vol. 8681:
Metrology, Inspection, and Process Control for Microlithography XXVII
Alexander Starikov; Jason P. Cain, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?