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Proceedings Paper

New materials and processes for directed self-assembly
Author(s): Shih-wei Chang; Jessica P. Evans; Shouren Ge; Valeriy V. Ginzburg; John W. Kramer; Brian Landes; Christopher Lee; Greg F. Meyers; Daniel J. Murray; Jong Park; Rahul Sharma; Peter Trefonas III; Jeffrey D. Weinhold; Jieqian Zhang; Phillip D. Hustad
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Paper Abstract

Directed self-assembly (DSA) of block copolymers (BCPs) is a promising technology for advanced patterning at future technology nodes, but significant hurdles remain for commercial implementation. The most widely studied material for DSA is poly(styrene-block-methyl methacrylate) (PS-PMMA), but the relatively weak segregation strength of PSPMMA results in some limitations. This paper reports on these limitations for PS-PMMA and highlights a path to success through use of more strongly segregated “high-χ” block copolymers. In general, stronger segregation is predicted to lower defectivity at equilibrium, but unfortunately, kinetics of self assembly also becomes much slower as segregation strength increases. Recognizing diffusion is much faster for cylinder morphologies than lamellar ones, we have investigated new cylinder-forming BCPs that enable defect elimination with thermal annealing processes. In addition, a formulation strategy is presented that further improves the kinetics of the assembly process, enabling tremendous improvements in defectivity over simple BCP systems. Excitingly, successful chemoepitaxy DSA with a high-χ lamellar BCP is also demonstrated using a thermal annealing process and no top coat. These technologies hold promise to enable DSA with thermal annealing processing across pitches from 40 - 16 nm.

Paper Details

Date Published: 26 March 2013
PDF: 9 pages
Proc. SPIE 8680, Alternative Lithographic Technologies V, 86800F (26 March 2013); doi: 10.1117/12.2011604
Show Author Affiliations
Shih-wei Chang, Dow Electronic Materials (United States)
Jessica P. Evans, The Dow Chemical Co. (United States)
Shouren Ge, The Dow Chemical Co. (United States)
Valeriy V. Ginzburg, The Dow Chemical Co. (United States)
John W. Kramer, The Dow Chemical Co. (United States)
Brian Landes, The Dow Chemical Co. (United States)
Christopher Lee, Dow Electronic Materials (United States)
Greg F. Meyers, The Dow Chemical Co. (United States)
Daniel J. Murray, The Dow Chemical Co. (United States)
Jong Park, Dow Electronic Materials (United States)
Rahul Sharma, The Dow Chemical Co. (United States)
Peter Trefonas III, Dow Electronic Materials (United States)
Jeffrey D. Weinhold, The Dow Chemical Co. (United States)
Jieqian Zhang, Dow Electronic Materials (United States)
Phillip D. Hustad, Dow Electronic Materials (United States)

Published in SPIE Proceedings Vol. 8680:
Alternative Lithographic Technologies V
William M. Tong, Editor(s)

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