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Proceedings Paper

High-volume process monitoring of FEOL 22nm FinFET structures using an automated STEM
Author(s): Ozan Ugurlu; Michael Strauss; Gavin Dutrow; Jeff Blackwood; Brian Routh Jr.; Corey Senowitz; Paul Plachinda; Roger Alvis
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Paper Abstract

The automated metrology capabilities of a STEM using a commercially available 22nm microprocessor were evaluated. Artifact-free TEM samples with a thickness of 10-15nm were prepared from inverter structures at various locations within an SRAM array. Static and dynamic precision measurements made on fin and gate stack features show sub-nm precision, suggesting that fully automated STEM metrology on finFET devices is capable of supporting finFET production. This paper also discusses sample preparation, automated data acquisition and data analysis, as well as the throughput benefits that arise from hardware connectivity between the sample prep and data acquisition tools. Simultaneous STEM imaging and compositional analysis is also briefly discussed.

Paper Details

Date Published: 18 April 2013
PDF: 14 pages
Proc. SPIE 8681, Metrology, Inspection, and Process Control for Microlithography XXVII, 868107 (18 April 2013); doi: 10.1117/12.2011594
Show Author Affiliations
Ozan Ugurlu, FEI Co. (United States)
Michael Strauss, FEI Co. (United States)
Gavin Dutrow, FEI Co. (United States)
Jeff Blackwood, FEI Co. (United States)
Brian Routh Jr., FEI Co. (United States)
Corey Senowitz, FEI Co. (United States)
Paul Plachinda, FEI Co. (United States)
Roger Alvis, FEI Co. (United States)

Published in SPIE Proceedings Vol. 8681:
Metrology, Inspection, and Process Control for Microlithography XXVII
Alexander Starikov; Jason P. Cain, Editor(s)

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