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Proceedings Paper

Progress in resolution, sensitivity, and critical dimensional uniformity of EUV chemically amplified resists
Author(s): James Thackeray; James Cameron; Vipul Jain; Paul LaBeaume; Suzanne Coley; Owendi Ongayi; Mike Wagner; Aaron Rachford; John Biafore
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Paper Abstract

This paper will discuss further progress obtained at Dow for the improvement of the Resolution, Contact critical dimension uniformity(CDU), and Sensitivity of EUV chemically amplified resists. For resolution, we have employed the use of polymer-bound photoacid generator (PBP) concept to reduce the intrinsic acid diffusion that limits the ultimate resolving capability of CA resists. For CDU, we have focused on intrinsic dissolution contrast and have found that the photo-decomposable base (PDB) concept can be successfully employed. With the use of a PDB, we can reduce CDU variation at a lower exposure energy. For sensitivity, we have focused on more efficient EUV photon capture through increased EUV absorption, as well as more highly efficient PAGs for greater acid generating efficiency. The formulation concepts will be confirmed using Prolith stochastic resist modeling. For the 26nm hp contact holes, we get excellent overall process window with over 280nm depth of focus for a 10% exposure latitude Process window. The 1sigma Critical dimension uniformity [CDU] is 1.1 nm. We also obtain 20nm hp contact resolution in one of our new EUV resists.

Paper Details

Date Published: 29 March 2013
PDF: 12 pages
Proc. SPIE 8682, Advances in Resist Materials and Processing Technology XXX, 868213 (29 March 2013); doi: 10.1117/12.2011565
Show Author Affiliations
James Thackeray, The Dow Chemical Co. (United States)
James Cameron, The Dow Chemical Co. (United States)
Vipul Jain, The Dow Chemical Co. (United States)
Paul LaBeaume, The Dow Chemical Co. (United States)
Suzanne Coley, The Dow Chemical Co. (United States)
Owendi Ongayi, The Dow Chemical Co. (United States)
Mike Wagner, The Dow Chemical Co. (United States)
Aaron Rachford, The Dow Chemical Co. (United States)
John Biafore, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 8682:
Advances in Resist Materials and Processing Technology XXX
Mark H. Somervell, Editor(s)

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