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Proceedings Paper

DSA hole defectivity analysis using advanced optical inspection tool
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Paper Abstract

This paper discusses the defect density detection and analysis methodology using advanced optical wafer inspection capability to enable accelerated development of a DSA process/process tools and the required inspection capability to monitor such a process. The defectivity inspection methodologies are optimized for grapho epitaxy directed self-assembly (DSA) contact holes with 25 nm sizes. A defect test reticle with programmed defects on guide patterns is designed for improved optimization of defectivity monitoring. Using this reticle, resist guide holes with a variety of sizes and shapes are patterned using an ArF immersion scanner. The negative tone development (NTD) type thermally stable resist guide is used for DSA of a polystyrene-b-poly(methyl methacrylate) (PS-b-PMMA) block copolymer (BCP). Using a variety of defects intentionally made by changing guide pattern sizes, the detection rates of each specific defectivity type has been analyzed. It is found in this work that to maximize sensitivity, a two pass scan with bright field (BF) and dark field (DF) modes provides the best overall defect type coverage and sensitivity. The performance of the two pass scan with BF and DF modes is also revealed by defect analysis for baseline defectivity on a wafer processed with nominal process conditions.

Paper Details

Date Published: 18 April 2013
PDF: 7 pages
Proc. SPIE 8681, Metrology, Inspection, and Process Control for Microlithography XXVII, 86811A (18 April 2013); doi: 10.1117/12.2011177
Show Author Affiliations
Ryota Harukawa, KLA-Tencor Corp. (United States)
Masami Aoki, KLA-Tencor Corp. (United States)
Andrew Cross, KLA-Tencor Corp. (United States)
Venkat Nagaswami, KLA-Tencor Corp. (United States)
Tadatoshi Tomita, Tokyo Electron Kyushu Ltd. (Japan)
Seiji Nagahara, Tokyo Electron Ltd. (Japan)
Makoto Muramatsu, Tokyo Electron Kyushu Ltd. (Japan)
Shinichiro Kawakami, Tokyo Electron Kyushu Ltd. (Japan)
Hitoshi Kosugi, Tokyo Electron Kyushu Ltd. (Japan)
Benjamen Rathsack, Tokyo Electron America, Inc. (United States)
Takahiro Kitano, Tokyo Electron Kyushu Ltd. (Japan)
Jason Sweis, Cadence Design Systems, Inc. (United States)
Ali Mokhberi, Cadence Design Systems, Inc. (United States)

Published in SPIE Proceedings Vol. 8681:
Metrology, Inspection, and Process Control for Microlithography XXVII
Alexander Starikov; Jason P. Cain, Editor(s)

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