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Proceedings Paper

Line edge roughness measurement technique for fingerprint pattern in block copolymer thin film
Author(s): Miki Isawa; Kei Sakai; Paulina A. Rincon Delgadillo; Roel Gronheid; Hiroshi Yoshida
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Paper Abstract

Fingerprint edge roughness (FER) is proposed to characterize high frequency roughness of fingerprint pattern edges assembled by lamella forming block copolymer (BCP). The FER is a roughness index which does not include the roughness component of the fingerprint curvature. A technique to evaluate FER by using CD-SEM is also proposed. Centerline of the fingerprint patterns were extracted by utilizing binarization and slimming algorithm, and line width, line width roughness and line edge roughness along the centerline were measured. The FER thus measured showed a good agreement with those determined by utilizing conventional line edge roughness analyzing algorithm. The FERs of fingerprint patterns assembled with various BCP formulations were analyzed. As a result, the proposed technique successfully detected the line edge roughness difference between each BCP formulations with different compositions. The results indicate that the FER might be a useful index to evaluate the patterning performance of BCP as a material for DSA process. The proposed technique will provide a method for fast and easy development of BCP materials and processes

Paper Details

Date Published: 10 April 2013
PDF: 6 pages
Proc. SPIE 8681, Metrology, Inspection, and Process Control for Microlithography XXVII, 868114 (10 April 2013); doi: 10.1117/12.2010915
Show Author Affiliations
Miki Isawa, Hitachi High-Technologies Corp. (Japan)
Kei Sakai, Hitachi High-Technologies Corp. (Japan)
IMEC (Belgium)
Paulina A. Rincon Delgadillo, IMEC (Belgium)
The Univ. of Chicago (United States)
Roel Gronheid, IMEC (Belgium)
Hiroshi Yoshida, Hitachi, Ltd. (Japan)

Published in SPIE Proceedings Vol. 8681:
Metrology, Inspection, and Process Control for Microlithography XXVII
Alexander Starikov; Jason P. Cain, Editor(s)

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