
Proceedings Paper
Laser displacement sensor to monitor the layup process of composite laminate productionFormat | Member Price | Non-Member Price |
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Paper Abstract
Several types of flaw can occur during the layup process of prepreg composite laminates. Quality control after the production process checks the end product by testing the specimens for flaws which are included during the layup process or curing process, however by then these flaws are already irreversibly embedded in the laminate. This paper demonstrates the use of a laser displacement sensor technique applied during the layup process of prepreg laminates for in-situ flaw detection, for typical flaws that can occur during the composite production process. An incorrect number of layers and fibre wrinkling are dominant flaws during the process of layup. These and other dominant flaws have been modeled to determine the requirements for an in-situ monitoring during the layup process of prepreg laminates.
Paper Details
Date Published: 19 April 2013
PDF: 8 pages
Proc. SPIE 8692, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2013, 86922T (19 April 2013); doi: 10.1117/12.2009177
Published in SPIE Proceedings Vol. 8692:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2013
Jerome Peter Lynch; Chung-Bang Yun; Kon-Well Wang, Editor(s)
PDF: 8 pages
Proc. SPIE 8692, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2013, 86922T (19 April 2013); doi: 10.1117/12.2009177
Show Author Affiliations
Nick Miesen, Delft Univ. of Technology (Netherlands)
Roger M. Groves, Delft Univ. of Technology (Netherlands)
Roger M. Groves, Delft Univ. of Technology (Netherlands)
Jos Sinke, Delft Univ. of Technology (Netherlands)
Rinze Benedictus, Delft Univ. of Technology (Netherlands)
Rinze Benedictus, Delft Univ. of Technology (Netherlands)
Published in SPIE Proceedings Vol. 8692:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2013
Jerome Peter Lynch; Chung-Bang Yun; Kon-Well Wang, Editor(s)
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